Wafer Thickness
See Also: Wafer, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Product
Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN 650 3D
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Optik Elektronik Gerätetechnik GmbH
High accurate flatness & thickness measuring system for large substrates.
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Product
ECHO 8 Ultrasonic Corrosion and Precision Thickness Gage
ECHO 8
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Danatronics offers our newest ultrasonic precision thickness gage line, the ECHO 8 series. ECHO 8 represents our most advanced thickness gage ever combining dual and single element transducers all in one small package. ECHO 8 offers a 3.5” high resolution sunlight readable color display with live A-Scan, use of a wide variety of dual, contact, delay line and immersion transducers from 1-20 Mhz as default and custom created and stored applications setups, B-Scan, datalogger with up to 32GB of SD card memory and interface to Microsoft excel. The ECHO 8 is available in 4 models including the ECHO 8, ECHO 8DL, ECHO 8W and ECHO 8DLW. The vibrate on alarm feature is the world’s first and is great for loud environments
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Product
Ultrasonic Thickness Gauge
38DL PLUS
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The 38DL PLUS is an innovative instrument that signals a new era in ultrasonic thickness gauging. Ideally suited for almost every ultrasonic thickness application, this handheld thickness gauge is fully compatible with a full line of dual and single element transducers. The versatile 38DL PLUS can be used in applications ranging from wall thinning measurements of internally corroded pipes with dual element probes to very precise thickness measurements of thin or multilayer materials with single element transducers.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Mechanical Coating Thickness Gauges
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Mechanical Coating Thickness Gauges are suitable for working in high risk areas such as high temperature or flammable atmospheres, underwater or where the risk of explosion is high and could be triggered by the use of an electronic instrument. From the simplest coating thickness gauge Elcometer 101 which will provide you with quick and immediate results to the more accurate coating thickness gauge Elcometer 211, also called the "banana gauge" which is ideal for cold and underwater surfaces.
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Product
Bottle Wall Thickness Measurement
CHY-G
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CHY-G Bottle Wall Thickness Measurement is suitable for measuring the bottom thickness and wall thickness of various bottles. On the basis of last generation thickness tester, the instrument adds a tray to stabilize the bottle to avoid measurement errors caused by the shaking of the bottle.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Surveyor Thickness Gauge
Multigauge 5650
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The Multigauge 5650 Surveyor Thickness Gauge is a simple, robust ultrasonic thickness gauge designed specifically for ship and small craft surveyors, but can also be used in applications where different measurement modes are required. The user has a choice of Multiple Echo, Echo to Echo or Single Echo to cover all requirements. The gauge can be used for metal, GRP or plastic measurement and it automatically switches modes and settings depending on the type of probe fitted. The easy to use keypad on the Surveyor Thickness Gauge allows operator interface whilst the bright LCD display can be used in all light conditions. All probes have Intelligent Probe Recognition (IPR), which automatically adjusts settings in the gauge at the same time as transmitting recognition data the result is a perfectly matched probe and gauge for enhanced performance. Additionally, the Automatic Measurement Verification System (AMVS) used with multiple echo ensures only true measurements are displayed, even on the most heavily corroded metals.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
Nonwoven Thickness Gauge
DRK141P-II
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Shandong Drick Instruments Co., Ltd.
It is used to determine the thickness of bulky non-woven fabrics with a thickness of ≤ 20mm and the thickness of large-compression non-woven fabrics.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Asphalt Layer Thickness Measurement Devices
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ElektroPhysik Dr. Steingroever GmbH & Co. KG
Non-destructive road layer thickness measuring gauge to measure bituminous road layers or other electrically insulating road layers.
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Product
Portable Thickness Gauge
Magna-Mike 8600
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The Magna-Mike® 8600 is a portable thickness gauge that uses a simple magnetic method to make reliable and repeatable measurements on nonferrous materials. Operation of the Magna-Mike is very simple. Measurements are made when its magnetic probe is held or scanned on one side of the test material and a small target ball (or disk or wire) is placed on the opposite side or dropped inside a container.
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Ultrasonic Thickness Gauge
TI-45 Series
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You can instantly measure the thickness of a material simply by positioning a probe. This innovative gauge is widely used and is capable of measuring a variety of materials including iron, stainless steel, glass and ceramics.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Flaw Detector & Thickness Gauge
DFX-7+
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Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms.
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Product
UPG-07 Ultrasonic Precision Thickness Gages - Color
UPG-07
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100K thickness datalogger with export to Excel 8 0z. Operates on 2 AA batteries Measures all engineering material Store and Recall setup for use with multiple materials All software options are field-upgradeable Vibrate and color change on alarm Illuminate the keypad on alarm condition Inform the operator when to replace the transducer Simple user-interface
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Compact Coating Thickness Gauges
MP0 Series
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The small all-rounders for mobile coating thickness measurement. Leading industrial instrument series for fast and easy coating thickness measurement in corrosion protection and industrial applications.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Thickness Gauge
MX-5
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The MX-5 is a simple to use hand-held Ultrasonic Thickness Gauge. It offers features that make your job easier. An Alarm mode, Differential mode, high speed scanning, and data send are the main features of the MX-5. The MX-5 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Ultrasonic Material and Coating Thickness Gauge
CMX Series
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Ultrasonic Material and Coating Thickness Gauge - CMX Series is a full function ultrasonic thickness and coating gauge with a widest variety of modes and features for extra versatility.
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Product
Ultrasonic Thickness Gauge
45MG
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The 45MG is an advanced ultrasonic thickness gauge packed with standard measurement features and software options. This unique instrument is compatible with the complete range of Olympus dual element and single element thickness gauge transducers, making this innovative instrument an all-in-one solution for virtually every thickness gauge application.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Coating Thickness Gauge for Ferrous and Non-Ferrous Materials
CM8856
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* It meets the standards of both ISO2178 and ISO 2361 as well as DIN, ASTM and BS. It can be used both in the laboratory and in harsh field conditions.* The F probes measure the thickness of non-magnetic materials (e.g. paint,plastic, porcelain enamel, copper, zinc,aluminum , chrome etc.) on magnetic materials (e.g. iron, nickel etc.) . often used to measure the thickness ofgalvanizing layer, lacquer layer, porcelain enamel layer, phosphide layer, copper tile, aluminum tile, somealloy tile, paper etc.The N probes measure the thickness of non - magnetic coatings on non-magnetic metals .It is used on anodizing, varnish, paint, enamel,plastic coatings, powder, etc. appliedto aluminum, brass, non-magnetic stainless steel, etc.* Automatic substrate recognition.* Manual or automatic shut down.* Two measurement mode: Single andContinuous* Wide measuring range and highresolution.* Metric/Imperial conversion.* Digital backlit display gives exactreading with no guessing or errors.* Can communicate with PC computerfor statistics and printing by theoptional cable.* Can store 99 groups of measurements.* Statistics is available.2.SPECIFICATIONSDisplay: 4 digits LCD, backlitRange: 0~1250 μm/0~50mil(other ranges can be specified )Min.radius workpiece: F: Convex 1.5mm/Concave 25mmN: Convex 3mm/ Concave 50mmMin. measuring area: 6mmMin.Sample thickness : 0.3mmResolution: 0.1 μm (0~99.9μm);1 μm (over 100μm)Accuracy: ±1~3%n or 2.5 μm or 0.1mil(Whichever is the greater)Bttery Indicator: Low batter indicator.PC interface: with RS-232C interfacePower supply: 2x1.5 AAA(UM-4) batteryOperating condition: Temp. 0~50℃ .Humidity <95% .Size: 126x65x35 mm; 5.0x2.6x1.6 inchWeight: about 81g(not including batteries)Standard accessories:Carrying case ...................1 pc.Operation manual ............ 1 pc.F probe in built .................1 pc.NF probe in built...............1 pc.Calibration foils ..............1set.Substrate (Iron) ................1 pc.Substrate (Aluminium)......1 pc.Optional accessories: RS-232C cable & software:1.USB adaptor for RS-232C2.Bluetooth interface
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High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
