Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
Module Accessory Kit, Quantity 26 2-56 x .187" Socket Head Cap Screws
510109305
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Used with modules: 510104128, 510104133, 510104134, 510104135, 510104136, 510104139 and 510104261.
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Product
Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
GFCI Socket Tester
ST120
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The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Product
Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
510109359
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Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
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Product
4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Product
Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws
510109300
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Module Accessory Kit, Quantity 39 0-80 x .250" Socket Head Cap Screws.Used with 90 Series modules p/n's : 510104120, 510104123, 510104267 and 510104270.
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Product
Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
510109303
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Module Accessory Kit, Quantity 26 4-40 x .560" Socket Head Cap Screws
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Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Product
Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
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Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Burn-in Environmental Test Chamber
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Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's High Temperature Aging Chamber is widely applied for automotive parts ,electronic and electric products ,components and materials by constant high temperature reliability test.
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Product
Socket Saver
4690
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The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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Product
RF Bias Burn-In System
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These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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Product
Burn-In System
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The COBIS-II Series Burn-in System is designed to test the latest high frequency integrated circuits (ICs) and combines a large capacity oven with well proven Accutron FlexBID™ dynamic driver technology. This system is engineered for productive dynamic device testing and reliable monitoring.
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Product
Modular TPC - Computing Box Module With Intel® 12th/13th/14th Gen./BTL S Core™ I CPU Socket (LGA1700)
TPC-B620
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High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR5) support up to 64GB in totalComprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
Three-Phase Smart Socket
WECO 3230
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Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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Product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
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Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
Socket Tester with RCD Tripping
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Shanghai Beha Electronics Co., Ltd.
*Mains wiring polarity check.*ELCB/RCD testing.*Measuring ear for line current.*Measuring ear for leakage current.*Helps calculate insulation resistance.*Helps calculate power consumption.*Helps fault finding of standing earth fault.*Fused main adapter.*Appliance testing (with the ad of a clamp meter).
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Product
Surface Mount Ball & Socket Test Point
SMOX
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SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Product
3 Position Plug Socket Switch Life Tester
CZKS-3
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It is designed according to terms and conditions of IEC60884-1, IEC60669-1, GB2099.1-2008 and GB16915.1-2003, for life test of plug and socket and switch products of household and similar use appliances.The device can connect with matched load cabinet, in order to conduct a test of electrical life, normal operation and breaking capacity. The equipment provides some clamps. It can test plug and socket production, wall switch, rocker switch, dial plate switch and button switch.
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Product
Cigarette Lighter Socket Sensor
FT-0801
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The FT-0801 cigarette lighter socket sensor detects ignition noise of voltage from cigarette lighter socket sensor as rotation signal. Useful for signal detection from a cigarette lighter socket equipped in an automobile or construction machinery.Rotation signal can be detected from a cigarette lighter socket by using the FT-0801 even if it is difficult to attach a rotation detector inside of an engine room.
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Product
Laser Diode Reliability Burn-In / Life-Test System
58602
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Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
