Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
-
Product
230V AC Socket Tester(For UK)
1942
-
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon indicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1W*Frequency: 50Hz
-
Product
Socket Outlet Tester
-
Using the new Testavit Schuki 1 LCD and 3 LCD, specialists easily check to see if sockets, cable drums or connecting cables are correctly connected in 230 V installations. Due to three LEDs, the connection status can be quickly and clearly determined. In addition, through the finger contact, it can be tested to see whether an impermissible, high contact voltage is applied at the protective earth connection. In addition, using the Testavit Schuki 1 LCD, a 30 mA FI circuit breaker (RCD) can be triggered via a pushbutton.
-
Product
Memory Burn-In Tester
H5620/H5620ES
-
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
-
Product
Module Accessory Kit, Quantity 26, 4-40 x .50" Socket Head Cap Screws Stainless Steel
510109495
Accessory Kit
Used with modules: 510108240.
-
Product
1U Rackmount Network Appliance Platform With LGA1151 Socket Intel® Core™/Xeon® E-2100 Series Processor, Intel® C246/H310 And Up To 26 LANs
NA590
-
*LGA1151 socket 8th gen Intel® Core™/Xeon® E-2100 series processor (Coffee Lake)*Four DDR4-2666 U-DIMM for up to 64GB of memory*Max. up to twenty-six 10/100/1000 Mbps Ethernet ports*Two expandable LAN modules supporting 1GbE/10GbE/25GbE/40GbE/Fiber/Copper/Bypass*Supports 1U redundant power supply for optional*Supports IPMI/TPM for optional*Suitable for network security, cloud computing and data centers applications
-
Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 2 HDMI, DisplayPort, 4 GbE LAN, 6 USB, PCIe X4/PCI Slot And 9 To 36 VDC
eBOX700-891-FL
-
The eBOX700-891-FL is an expansion-rich fanless embedded system powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Kaby Lake) with the Intel® H110 chipset. It supports dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. This embedded box PC comes with a user-friendly mechanism design and offers great flexibility, reliability, and scalability, well suited for vision inspection (USB/PoE), motion control, security surveillance and industrial automation. The eBOX700-891-FL is designed with user friendliness in mind. Its heatsink top cover can simply be opened by unfastening the four screws for the access to the processor and DRAM. Moreover, its bottom cover adopts a convenient flip lid design along with easy-to-access brackets for securing the USB dongle and hard drive. Axiomtek has obtained patents, No. M511183 and No. M531115, for the special chassis design of the eBOX700-891-FL. Easy maintenance is one of the advantages we are offering to our customers and one of the main focuses of our product development. We will continue pursuing excellence and innovation in design and manufacturing.
-
-
Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
-
*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
-
Product
180V-260V AC Socket Tester (For UK)
1941
-
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*LED indicators & Digital display.*Test for 180-260VAC circuit.I*t can perform self test after plug-in ( Voltage sould be above 180V ).*Detect faulty wiring status in 3 wire receptacle.*This socket tester will give LED indication as well if the main voltage is below 200V or above 260V.*Earth loop impedance test.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 4W*Frequency: 50Hz
-
Product
Laser Diode Burn-In Testing
-
Laser reliability testing consists of a series of tests that laser diodes can be put under in order to ensure their reliability for post-production use. There are different types of tests that can be carried out and there are multiple measurements that can be taken in order to evaluate the reliability of the device. One of these tests is laser diode burn-in.
-
Product
4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
-
The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
-
Product
Module Accessory Kit, Quantity 26, 4-40 x .375" Socket Head Cap Screws
510109301
Accessory Kit
Used with modules: 510104118 and 510108104.
-
Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
-
Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
-
Product
Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
-
Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
-
Product
Burn-In Test Fixtures
-
Burn-in generally involves the extended operation of a product in a temperature-controlled environment. With possible humidity and supply voltage margining - the burn-in process can then be extended to include power stress (levels and on/off cycles) tests, high humidity environmental simulation as well as the classic "four corner test" of high voltage + high temperature, high voltage + low temperature, low voltage + high temperature and low voltage + low temperature.
-
Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
-
132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
-
Product
Camera Module Socket
-
Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
-
Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
-
The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
-
Product
230V AC Socket Tester With RCD Test (For UK)
1944
-
Peaceful Thriving Enterprise Co Ltd
*With UKCA Approval.*Test for 230VAC circuits.*Neon indicators.*RCD Test.*30mA leakage current measurement.*Detect faulty wiring status in 3 wire receptacle.*Various combinations of 3 neon idnicators tell if wiring is OK or 6 possible faulty conditions.*Power Plug type: UK 13A socket-outlet*Measurement Category: CAT II / 1.5W*Frequency: 50Hz
-
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
Micro ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
MMB501
-
The MMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors (formally codename: Kaby Lake/Skylake) with Intel® Q170 chipset. The MMB501 supports four high bandwidth 288-pin DDR4-2133/2400 with a memory capacity up to 64GB. The industrial-grade micro ATX motherboard is expandable with one PCIe x16 slot, two PCIe x4 slots, one PCI slot and one full-size PCI Express Mini Card slot. Moreover, the embedded board supports triple-display via DisplayPort, HDMI, DVI-D and VGA interfaces. Furthermore, this outstanding multi-function embedded motherboard is integrated with the Intel® HD Graphics 530/510 to deliver stunning UHD 4K resolution and fast 3-D and video playback for graphics-intensive applications. To meet the distinct needs from users, there are six SATA-600 with RAID 0/1/5/10, six USB 3.0, five USB 2.0, four RS-232 ports, two RS-232/422/485 ports, one DisplayPort, one DVI-D, one HDMI and one VGA, as well as has two Gigabit Ethernet ports with Intel® i219LM and Intel® i211AT controllers. To ensure stable and reliable operation, the high-performance Intel® Core™-based industrial micro ATX motherboard supports a watchdog timer and hardware monitoring features. Furthermore, this new embedded board runs well with Windows® 7, and Windows® 10 operating systems.
-
Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
-
The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
-
Product
Tester, US Mains Socket
72-6861
-
The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
-
Product
MultiSite Test sockets and Wafer Level
-
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
-
Product
Lo-PRO®file ZIF (Zero-Insertion-Force) Socket
Series 526
-
LO-PRO file Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal.
-
Product
Open Pluggable Specification-Plus (OPS+) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q370 And TPM 2.0
OPS700-520
-
The OPS700-520 is an Open Pluggable Specification Plus (OPS+) digital signage player. The high-performance signer player is powered by the high-performance LGA1151 socket 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Coffee Lake S) with the Intel® Q370 chipset. This OPS+ digital signage module supports Trusted Platform Module (TPM) 2.0, Intel® Active Management Technology (Intel® AMT) 11.0 as well as Intel Unite® solution for content sharing and collaboration. It comes with two 260-pin DDR4-2400 SO-DIMM sockets that can provide system memory of up to 32GB. The Coffee Lake S-based OPS700-520 offering future-proofed flexibility and performance is among one of the most advanced and powerful digital signage players in the market.
-
Product
Module Accessory Kit, Quantity 26, 4-40 x .625" Captive Socket Head Cap Screws
510109366
Accessory Kit
Used with modules: 510104135, 510104136, 510150115, 510150116, 510150130, 510150136, 510150137, 510150147, 510151105, 510151106 and 510151124.
-
Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
-
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
-
Product
Test Socket
-
Our test sockets are made for high performance and are of top quality, to guarantee a smooth, effortless process. We believe in providing our partners and customers with effective and intelligent solutions that they can apply with ease. Choose the solutions of TTS Group cater to the needs of detailed and complex systems.
