Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Product
IEC60065 Socket Torque Balance Tester Torsion Tester
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Shenzhen Chuangxin Instruments Co., Ltd.
*Plug and Socket Torque Tester/Device is for compliance is checked by engaging the device, as during intended use, with the socket-outlet of a test apparatus. *Plug Torque Tester/Equipment is a device provided with pins intended to be introduced into fixed socket-outlets shall not impose undue strain on these socket-outlets.The balancing arm of the test apparatus pivots about a horizontal axis through the centre lines of the contact tubes of the socket-outlet at a distance of 8 mm behind the engagement face of the socket-outlet.*With the machine not in engagement, the balancing arm is in equilibrium, the engagement face of the socket-outlet being in the vertical position.After the device has been engaged, the torque to be applied to the socket-outlet to maintain its engagement face in the vertical plane is determined by the position o a weight on the balancing arm.
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Product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
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DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
Socket Wrench Torque Sensor Reaction Type
SWS SERIES
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Our SWS Series reaction type socket wrench torque sensors are available in ranges from 10 ft-lbs. through 1000 ft-lbs. and provide accurate measurements of bolt or nut wrenching torques. These sensors are bi-directional so both tightening and break-away torques can be measured. These low cost sensors deliver high accuracy and outstanding frequency response. alibration of mechanical torque wrenches may be performed with this sensor. The sensing element incorporates bonded foil strain gages of the highest quality.
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Product
Socket Tester c/w Buzzer
DL1090
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Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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Product
Module Accessory Kit, Quantity 26 2-56 x .25" Socket Head Cap Screws Stainless Steel
510109375
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Used with modules: 510104306.
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Product
14th/13th/12th Gen. Intel® Core™ Processors (Alder Lake-S/Raptor Lake-S Series, LGA1700 Socket CPU) On 4" EPIC SBC
MIO-4370
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14th/13th/12th Gen. Intel® Core™ Processor up to 24 Cores, TDP 35WHigh scalability with socket type CPU (LGA1700) & Support Std. CPU coolerDDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI+eDPDual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM3 Expansions: Dual M.2 M-Key (support NVMe), M.2 E-KeySupports Windows 10 LTSC & Ubuntu 22.04 LTS, embedded software APIs, WISE-DeviceOn
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Product
Module Accessory Kit, Quantity 26, 4-40 x .50" Socket Head Cap Screws Stainless Steel
510109495
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Used with modules: 510108240.
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Product
Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Product
Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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Product
Socket Outlet Torque Test Device
CX-LJ
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Shenzhen Chuangxin Instruments Co., Ltd.
For measuring and testing the torque strain exerted by appliances with plug pins on socket-outlets, in accordance with IEC 60065 clause 15.4.1 and figure 11, IEC 60335-1 clause 22.3, IEC 60884-1 clause 14.23.2.
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Product
Socket Accessories (Thru-Hole Options)
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The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006″ to 0.018″ diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
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Product
Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
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Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Industrial & 3-Phase Socket Testers
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Martindale Electric Industrial & 3-Phase Socket Testers
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Product
Polyphase Socket Tester
K-281
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Knopp’s K-281 Polyphase Socket Tester is designed to detect backfeed conditions, grounds, short circuits and wiring errors in either a 120/240, 120/208 or 277/480 volt meter socket. It is equipped with high intensity Power Lights and Fault Lights to show whether or not the meter is safe to set. The Polyphase Socket Tester also comes with a heavy duty handle for quick and easy installation.
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Product
4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
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The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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Product
Photodiode Burn-in Reliability Test System
58606
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The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Module Accessory Kit, Quantity 26, 4-40 x 1.250" Socket Head Cap Screws Stainless Steel
510109597
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Used with modules: 510109315, 510150120, 510150125, 510150126, 510150127, 510150128, 510150141, 510150142, 510150143, 510150148, 510150152, 510150153, 510150154, 510150155, 510150210, 510150220, 510150227 and 510150238.
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Product
Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
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*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
