Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Probing Solutions
ES62X-CMPS
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The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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Camera Endpoint Monitor based on Real Time Laser Interferometry
LEM Series
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Our Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/deposition process.Depending on applications, LEM camera includes a 670 or 905 or 980 nm laser and when mounted on any dry etch/deposition process chamber with a direct top view of the wafer this generates a small laser spot on the sample surface.Interference occurs when monochromatic light hits the sample surface, resulting in different optical path lengths due to film thickness and height variations in the film.This allows the etch/deposition rate and thus thickness to be monitored in real time, also fringes counting or more complex analysis, providing enhanced process control Endpoint for a wide variety of processes. Additionally interfaces can be detected by their change in reflectivity.
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Wafer-Level Parametric Test
test
Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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microLED Testing System
OmniPix-ML1000
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The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.
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04 With Pins For PCB | 1 Wafer | 24 Positions
04-1xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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ResMap or DualMap Auto Load Table Top
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Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Probe Card
VC20E Series
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The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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MANIFULATOR
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As one of the most important module in Probe_Station, manipulator is an accurate system that probe micro distance() and contact on the electrode of semiconductor wafer, device. ECOPIA's Manipulator is very easy to use and probe arm's elastic plate is good to protect sample's surface, from being damaged by Z direction movement.
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EasyEXPERT group+ Device Characterization Software
EasyEXPERT group+
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Keysight EasyEXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities EasyEXPERT group+ is upgradable from the previous generation of EasyEXPERT/Desktop EasyEXPERT software.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Silicon Heavy-doped Pen Tester
HS-MPRT
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Heavy doped testing, especially good for purchase the material.■ Not only sound alarm, but also Led light alarm , to guarantee sorting work accurately.■ adaptable for sorting little granular material, little broken IC Wafer and other little silicon material.■ Can set alarm ranges from 0.0 to 1.0Ω﹡㎝.
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Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Trusted Semiconductor Die/Wafer Source
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To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
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*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
