Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Superlattice Doping / ALD Services
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Alacron, Inc. is capable of processing sensor wafers on a contract basis to produce backside illuminated wafers sensitive in the UV and soft X-Ray region with an array of anti-reflective coatings based on licensed patented, (US 8,395,243 and US 8,680,637), technology from Jet Propulsion Laboratory (JPL).
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Product
Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Product
Ultra-Low Frequency Workstation
MK52 Series
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Providing Ultra-Low Frequency levels, the MK52 Series offers the ultimate low natural frequency performance for a wide range of high resolution instruments, such as analytical balances, cell injection, confocal microscopes, patch clamping, optical microscopes, wafer probing, sensor calibration, atomic force microscopes and other sensitive equipment requiring high isolation efficiency.
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Product
Minority Carrier Life Time System
MWR-SIM
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MWR-SIM Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as probe.It enables repetition and contactless of measurement and does not require specialsurface treatment before measurement or wafer cutting.
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Patterning Simulation
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KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Product
Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Quick Silicon Discriminator
HS-QSD
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HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Product
Mask Flatness Measurement System
Tropel® UltraFlatTM 200 Mask System
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The Tropel® UltraFlatTM 200 Mask System was designed specifically for the photomask industry. It delivers the lowest measurement uncertainty for ever-tightening mask flatness specifications. Shrinking device features require not only flatter wafers, but flatter masks.
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Product
Translating process images into significant tool-defect reduction
Trans-Imager
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Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Product
High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
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Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
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Product
Test House Services
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Microtest provides complete test house services in a clear room equipped with the state of the art handler and wafer probing system using its own innovative ATE.The test house operates in hot, cold and room temperature for both production and characterization test.Innovative reliability system for Burn In and HTOL ServicesStatistical analysis is performed for digital and mixed-signal devices.Microtest Pacific Test house is located in Malacca (Malaysia).
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Silicon O/C Content Tester
OCT-2000
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Die Sorter Handler
4605-HTR
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4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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Product
MPI Manual Probe Systems
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MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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Product
300mm Single Touchdown Burn-in and Test System
FOX-15
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Up to 15 wafers at a time Known Good Die solution Lowers production cost
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Product
TFProbe Wafer Measurement Tools
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Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Product
Non-contact Sheet Resistance /resistivity Measurement Instrument
EC-80
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*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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Product
Non-contact Conductivity Type (P/N) Checker For Quick Check
PN-50α
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*Principle: Photovoltaic effect by light pulse irradiation*No damage and no stain by Non-contact method*Possible to check even oxidized film on wafer surface*Instantly discrimination by optical pulse illuminate
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Product
CMP Process and Material Characterization System
CP-4
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he new Bruker CP-4 CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes. Reproduces full-scale wafer polishing-process conditions. Provides unmatched measurement repeatability and detail. Performs tests on small coupons rather than whole wafers for substantial cost savings.
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Product
AI ANALYZER
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Nanotronics uses artificial intelligence to give our customers’ unprecedented freedom and control for defect detection. We offer an AI based Anomaly Detection Algorithm (ADA) toolkit that automates the work of writing computer vision algorithms to detect and classify defects on bare substrate and epi wafers as well as on thin films, glass and any other material with a uniform background.
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Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
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The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Product
EasyEXPERT group+ Device Characterization Software
EasyEXPERT group+
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Keysight EasyEXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities EasyEXPERT group+ is upgradable from the previous generation of EasyEXPERT/Desktop EasyEXPERT software.
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Product
Noise Sources
WGNS
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The system allows the user to extend the frequency range of the NFA to allow for accurate noise figure measurements to be performed on a device operating in the 26.5 – 170GHz range on wafer as well as in benchtop applications. Farran offers the WGNS series of noise sources to be used in conjunction with the FBC down converters for use as frequency extenders for noise figure measurement test system.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Semi-automated Metrology System
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Full wafer surface scanning for thickness, thickness variation, bow, warp, sori, site and global flatness
