Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
-
Product
Wafer Sorter and Inspection
SolarWIS Platform
-
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
-
Product
Wafer Analysis Systems
Tropel®
-
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
-
Product
Probe Cards
-
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
-
Product
Light and Energy Meter
Model 659
-
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
-
Product
Semiconductors on Film-Frame
Ismeca NY32W
-
32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.
-
Product
Wafer Prober
Prexa
-
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
-
Product
MPI Automated Probe Systems
-
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
-
Product
Semiconductor Test Equipment
IC Tester
-
Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
-
Product
microLED Testing System
OmniPix-ML1000
-
The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.
-
Product
MANIFULATOR
-
As one of the most important module in Probe_Station, manipulator is an accurate system that probe micro distance() and contact on the electrode of semiconductor wafer, device. ECOPIA's Manipulator is very easy to use and probe arm's elastic plate is good to protect sample's surface, from being damaged by Z direction movement.
-
Product
Vacuum Probing Systems
-
Built using our PS4L patented technology, SemiProbe manufactures a family of Vacuum Probing Systems, which test wafers or substrates in a vacuum environment. Additionally, individual die and broken/partial wafers can be tested with the Vacuum Probing System. All key modules are interchangeable and upgradeable.
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
-
Product
Batch Wafer Transfer Tools
-
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Batch Wafer Transfer Tools
-
Product
Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
-
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
-
Product
Reticle Manufacturing
-
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
-
Product
Stand-alone Ozone Delivery System For Advanced Processes
SEMOZON® AX8585
-
SEMOZON® AX8585 stand-alone ozone gas delivery system is designed around the AX8410 PRIME ozone generator to provide high flow, high concentration, ultra clean ozone generation and delivery. This fully configurable product line is designed to meet the ever changing needs of the semiconductor industry. Each SEMOZON AX8585 is a fully integrated, high output ozone gas delivery system intended for use in an increasing number of semiconductor process applications such as ALD, CVD, TEOS/Ozone CVD, photoresist strip, wafer cleaning, contaminant removal, and oxide growth.
-
Product
Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
-
Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
-
Product
STDF Test Data Analysis Tool
DataView
-
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
-
Product
Advanced Low-Frequency Noise Analyzer
E4727B
-
Get a deeper, closer look at low frequency noise with the A-LFNA integrated with WaferPro Express, featuring data analysis, wafer prober control and test suite automation.
-
Product
Measuring Microscopes, Image Processing + Semiconductor Technology, Micro Scriber
Line Width Measurement
-
Optik Elektronik Gerätetechnik GmbH
COMEF is an image processing software with special functions for the highly accurate measurement of line width and line distance. Using grey value algorithms, the width and distance of conductor lines or structures on silicon wafers can be measured with subpixel accuracy.
-
Product
Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
-
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
-
Product
ID Reader 8
-
ID Reader 8″ is the best tool to avoid lot errors. Designed for using 200mm – 8″ notch aligner and OCR system, it checks your carrier tag, reads each wafer scribes, then sends the information to your Host with SECSII Gem commands
-
Product
SlipFinder
YIS and SF Series
-
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.The SF300M and SF300N systems offer a low cost functionally equivalent alternative to the YIS series.
-
Product
Permanent Bonding Systems
-
The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
-
Product
Wafer Sort
-
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
-
Product
Device Parameter Analysis
-
bsw TestSystems & Consulting AG
The complexity of DC Parametric Characterisations has significantly increased with the level of miniaturisation in the semiconductor industry. The demand is not only on the precision of the measurements. New measurement methods have emerged to gain insight into phenomena previously unknown or only of marginal relevance. One example is "Pulsed IV" which is now widely in use. The modular concept of the Keysight B1500A allows users to tailor their instrument exactly to their needs. Flexible upgrades ensure the investment for many years. Together with bsw AG you will get an optimum solution for your application. Our experts provide not only support for the instrument itself but have also working knowledge of all the solutions surrounding it. This includes Cabeling and Adapters, Fixturing for packaged Parts and of course Wafer Probing. We help customers from replacements of broken or worn-out parts to planning and deployment of turn-key-systems.
-
Product
Table Tops Equipment
-
RECIF Technologies 150-200mm product range is composed of various kind of table tops equipment including wafer transfer, aligners and elevators.As a result of a technology license agreement, with its European partner EMU Technologies, RECIF proposes updated designs for its equipment line, without compromising the proven performances installed on the field for years.
-
Product
Dicing And Lapping Systems
-
In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
-
Product
Embedded Systems Projects
-
Precision Development Consulting Inc
Module Controller in Track System for silicon wafers, Static Headstack Tester, DOS Device Driver, LED Wafer Prober
-
Product
Noise Sources
WGNS
-
The system allows the user to extend the frequency range of the NFA to allow for accurate noise figure measurements to be performed on a device operating in the 26.5 – 170GHz range on wafer as well as in benchtop applications. Farran offers the WGNS series of noise sources to be used in conjunction with the FBC down converters for use as frequency extenders for noise figure measurement test system.
