Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Probe Card Solutions
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Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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Epi Thickness & Composition System
Element
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The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Pressure Sensors
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ST’s tiny silicon pressure sensors use innovative MEMS technology to ensure extremely high-pressure resolution in ultra-compact and thin packages. The devices implement proprietary technology for the fabrication of pressure sensors on monolithic silicon chips, which eliminates wafer-to-wafer bonding and maximizes reliability.
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Product
ESD Test System
58154 Series
Test System
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Product
Flat Carbon Sensor Conductivity meter
HE-960LF / FS-09F-1/2
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It is effective to keep the dilution of Slurry constant. Maintaining an appropriate conductivity value contributes to process stability in the wafer polishing process. Even highly viscous sample liquids such as CMP Slurry can be measured without problems because they use a sensor structure that reduces the risk of the sample liquid sticking to the electrodes. In addition, the sensor is made of a wetted material with excellent chemical resistance, which meets the cleanliness requirements of semiconductor processes. In addition to the above, it can also be used for introduction at the semiconductor process development stage and conductivity control of special chemicals.
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Mixed Signal Test Systems
MTS1020i
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The MTS-1020i is a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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Tri-Axial Vibration Test Tool
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AMHS and conveyor manufacturers utilize the Tri-Axial Vibration Test Tool to quantify and qualify the vibration characteristics during development, installation and maintenance of their systems. This industry-standard tool is used by 200mm and 300mm FABs to measure the vibration induced to wafer lots by their material handling systems. By detecting the early signs of track misalignment, systems can be maintained to minimize the vibration induced on the wafer lots.
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The Standard R&D Wafer-Lifetime Tool
WCT-120
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Best available lifetime measurement accuracy. Measure lifetime and surface recombination for a wafer of any quality or crystallinity.
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Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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ECHO VS System with Image Enhancement
Echo VS
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The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Product
Data Analytics
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KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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Fluorescence Spectrometers
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PicoQuant offers several fluorescence spectrometers that range from compact table-top spectrometers for teaching or daily routine work to modular high-end spectrometers with exact timing down to a few picoseconds. Samples can be liquids in standard cuvettes, solid samples or even semiconductor wafers for in-line quality control.
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
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The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Mixed Signal Test Systems
MTS1010i
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The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Patterning Simulation
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KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Manual Contactless Wafer Detector
HS-NCS-300
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Ceramic Process Carrier Pallets
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Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Metrology/SEM
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Our SEM products use scanning electron microscope technology to measure and review tiny surface structures such as photomask etching and circuitry on wafers with high precision and stability.
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Integrated Couplers/ Harmonic Mixers
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These waveguide bandwidth integrated coupler/mixers are designed to allow phase locking or signal monitoring of compact millimeter wave systems. RF inputs and outputs are on opposite sides of a thin wafer to obtain minimum insertion length. These devices use silicon Schottky barrier beam-lead diodes on a rugged stripline circuit. Nominal coupling value is 10 dB. For coupling values greater than 10 dB, non-directional coupler models are available (consult factory).
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Hi-Speed Discrete Test System
QT-6000
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QT-6000 Test System, with built-in capacitance test (DC+CAP) and Scanbox etc, is applicable to devices like medium & small power transistors, MOS-FET, diodes and Wafer.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
