Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
Infrared Microscope
DDR200 & DDR300
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The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required.
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
Platform
AXM XM8000 Wafer
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The complete solution for operator free, automated X-ray wafer metrology. XM8000 is specifically designed for inline use in clean room environments.
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Product
CMP
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CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Product
Semiconductor Test Services
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Tests regarding function, electrical and optoelectronical parameter. Electrical test of wafer up to 8? and packaged devices - selection and volume test.
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Product
Device Parameter Analysis
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bsw TestSystems & Consulting AG
The complexity of DC Parametric Characterisations has significantly increased with the level of miniaturisation in the semiconductor industry. The demand is not only on the precision of the measurements. New measurement methods have emerged to gain insight into phenomena previously unknown or only of marginal relevance. One example is "Pulsed IV" which is now widely in use. The modular concept of the Keysight B1500A allows users to tailor their instrument exactly to their needs. Flexible upgrades ensure the investment for many years. Together with bsw AG you will get an optimum solution for your application. Our experts provide not only support for the instrument itself but have also working knowledge of all the solutions surrounding it. This includes Cabeling and Adapters, Fixturing for packaged Parts and of course Wafer Probing. We help customers from replacements of broken or worn-out parts to planning and deployment of turn-key-systems.
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Product
Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Product
Grain Inspector
iS-G1
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The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
Multi-Surface Profiler
Tropel® FlatMaster® MSP
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The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Silicon heavy-doped Tweezer Tester
HS-MRTT
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Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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Product
Quick Silicon Discriminator
HS-QSD
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HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Product
EasyEXPERT Group+ Software (for PC)
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Keysight Easy EXPERT group+ GUI based characterization software is available for Keysight Precision Current-Voltage Analyzer Series. It is available on your PC or the B150xA's embedded Windows 7 platform with 15-inch touch screen to accelerate the characterization tasks. It supports efficient and repeatable device characterization in the entire characterization process from measurement setup and execution to analysis and data management either interactive manual operation or automation across a wafer in conjunction with a semiautomatic wafer prober. EasyEXPERT group+ makes it easy to perform complex device characterization immediately with the ready-to-use measurements (application tests) furnished, and allows you the option of storing test condition and measurement data automatically after each measurement in a unique built-in database (workspace), ensuring that valuable information is not lost and that measurements can be repeated at a later date. Keysight Precision Current-Voltage Analyzer Series provides the complete solution for device characterization with these versatile capabilities.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Product
Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
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Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
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Product
Memory Test System
T5221
Test System
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Resistivity Standard
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Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
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Product
Test Contactor/Probe Head
xWave
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Highest performance and most robust RF broadband production solution for package, wafer, or Over-the-Air (OTA) test for 100 GHz.The xWave™ test contactor / probe head utilizes patented hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging cmWave and mmWave devices. Inside the xWave test contactor / probe head are embedded patch antennas and coplanar waveguides for both wireless and wired communication.
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Product
Nanoimprint Lithography
NIL
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EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
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Product
Inline OEM High Resolution Thickness & Resistivity Module for PV / Solar Sorters
MX 152
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To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Product
Infrared Microscope
DDR200/300 NIR
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The McBain DDR200 NIR (for 200mm) and DDR300 NIR (for 300mm) provide high-speed defect detection and precision measurement on wafers and other parts. These cost-efficient systems offer unique advantages for both production and process development use, providing an optimum near-infrared (900-1700nm) solution when both subsurface defect detection and dimensional metrology are required.
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Product
Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Product
AMIDA 5000 Tester
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AMIDA 5000 is a high-end performance test system, combining analog, mixed-signal and logic with the latest test solutions. High pin count - as many as 512 smart multi-function pinframes and 128 sites. Ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. This system has a higher number of parallel tests and a higher level of capability. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The 5000 series test system is the best analog, mixed signal, digital IC, PA test system for engineering verification and mass production. It can be easily connected to all well-known wafer probing machines and sorters, and also supports parallel test functions. The 5000 series meets customers' needs for high-precision, high-resolution, high-reliability, user-friendly, and low-cost testing and measurement of test systems.
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Product
ESD Test System
58154 Series
Test System
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Product
Low-leakage Switch Matrix Family
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Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
