Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
-
Product
Wafer Probe Test System
STI3000
-
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
-
Product
RF Front-end
-
The RF integrated passive device (RF IPD) uses a high-resistivity substrate to integrate quality factor components such as capacitors and indictors. Many functions like impedance matching networks, harmonic filters, couplers, baluns, and power combiners/splitters can be designed using IPD technology. ST's IPDs are manufactured using thick film and HiRes Si or glass wafer manufacturing technology and photolithography processing.
-
Product
Benchtop Metrology Solution
FilmTek 2000 PAR-SE
-
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
-
Product
Polish Grinders
-
The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
-
Product
Ultra Pure Pressure Switch
W117G
-
The W117G Ultra Pure Stainless Steel Pressure Switches have all welded stainless steel interiors which are Helium leak checked to pass 4 x 10-9 Std CC/Sec. These switches are used in silicon wafer ovens, numerous medical devices and other applications where even the slightest impurities are not tolerated.
-
Product
Reticle Manufacturing
-
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
-
Product
Probe Cards
Direct Dock
-
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
-
Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
-
Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
-
Product
Silicon & Compound Wafers
-
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
-
Product
Microwave Plasma Subsystems
AX2600 And AX2700
-
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
-
Product
Warpage Metrology System
TableTop Shadow Moiré (TTSM)
-
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
-
Product
Tri-Axial Vibration Test Tool
-
AMHS and conveyor manufacturers utilize the Tri-Axial Vibration Test Tool to quantify and qualify the vibration characteristics during development, installation and maintenance of their systems. This industry-standard tool is used by 200mm and 300mm FABs to measure the vibration induced to wafer lots by their material handling systems. By detecting the early signs of track misalignment, systems can be maintained to minimize the vibration induced on the wafer lots.
-
Product
Silicon heavy-doped Tweezer Tester
HS-MRTT
-
Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
-
Product
MPI Automated Probe Systems
-
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
-
Product
Multi-Cell Test System
Cellcia
-
Next-generation wafer probing system for 300mm wafers. The multi-layer system structure maximizes the efficiency of testing, further reducing the total testing cost.
-
Product
Thermal Controlled Chucks & Plates
TOP Cool
-
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
-
Product
EpiStride SiC CVD System
-
Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
-
Product
Fluorescence Spectrometers
-
PicoQuant offers several fluorescence spectrometers that range from compact table-top spectrometers for teaching or daily routine work to modular high-end spectrometers with exact timing down to a few picoseconds. Samples can be liquids in standard cuvettes, solid samples or even semiconductor wafers for in-line quality control.
-
Product
Four-Point Probe
-
Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
-
Product
kSA Scanning Pyro
-
For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
-
Product
STDF Test Data Analysis Tool
DataView
-
DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
-
Product
Hybrid And Fusion Bonding Systems
-
Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
-
Product
Probecard testers
MANAGER
-
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
-
Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
-
The MX30x series are manual one-point Thickness gauges for silicon wafers.
-
Product
Test Contactor/Probe HEad
cRacer
-
The cRacer™ test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 100 µm to 650 µm, covering the majority of 5G devices.cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
-
Product
Portable Manual Probing Station
Model W4.0 x L6.5
-
This portable manual probing station is designed for a versatile, comfortable, and accurate operation on up to 4.0” wafers or 4.0” X 6.5” printed circuit board assemblies. This turn-key, manually operated probing station, model W4.0 x L6.5, is part of the D-COAX commitment to the test and measurement and PCB fabrication industries.
-
Product
Meters For Contact Angle And Surface Tension
SURFTENS HL
-
Optik Elektronik Gerätetechnik GmbH
Measuring instrument for contact angle and surface free energy, special solution for semiconductor technology for wafers up to 300 mm.
-
Product
Probe Card
VC43™/VC43EAF™
-
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
-
Product
120 A High Voltage 50 Ω Pulse Generator
TLP-12010C
-
High Power Pulse Instruments GmbH
- High pulse output current up to 120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical rise time 100 ps (0 A to 40 A) and 300 ps in high-current mode (0 A to 120 A)- Wafer, package and system level TLP, VF-TLP and HMM testing- Up to 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 USB programmable pulse rise times: 100 ps to 50 ns (custom selectable)- 8 (optional 9) programmable pulse widths: 0.5 ns (optional), 1 ns to 100 ns (0 A to 40 A), 1 built-in pulse width: 100 ns (>40 A)- The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0 A to 40 A)- Optional external pulse width extensions from 5 ns to 500 ns (>40 A to 120 A)using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient sofware for system control and waveform data management- The sofware can control automatic probers for fast measurements of complete wafers- Combines TLP-12010A and TLP-4010C into one system- Can be operated together with TLP-12012A6 and TLP-3011C pulse width extenders- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
-
Product
SlipFinder
YIS and SF Series
-
The YIS and SF Series metrology systems are designed for optical detection of wafer defects such as crystaldislocations, slip and other defects. The YIS-300HM (for 300 mm wafers) and YIS-200HM (for 200 mm wafers) utilizeMakyoh optics technology (Magic Mirror) and integrated robotic wafer handler provided by Hologenix.The SF300M and SF300N systems offer a low cost functionally equivalent alternative to the YIS series.
