Defect
other than specified, imperfection .
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Transistor-Level Defect Simulator
Tessent DefectSim
Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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Defect Isolation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Counterfeit Defect Coverage Tool
The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
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Building Defect Investigations and Surveys
Building defect investigations and surveys are needed not only when problems arise but when assurance is required that defects do not exist or that the standard of construction is such that problems are unlikely
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NUV-PL SiC Defect Inspection System
VS6845E
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Translating process images into significant tool-defect reduction
Trans-Imager
Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Relay and Protection Testing
HAOMAI Electric Test Equipment Co., Ltd.
These tests are done to show that protection relays are free from defects during manufacturing process.
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Automated Optical Inspection Solutions
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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Electronic Inspection Systems
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Vacuum Inspection
INDEC
INDEC vacuum test systems monitor a wide range of containers during the production process, including bottles, jars and cans, by measuring the cap panel concavity of their closures which is dependent on the vacuum inside. This non-contact inspection reliably identifies defective containers for automatic rejection.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Environmental Stress Screening (ESS) Chamber
ESS
Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
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Automated Visual Quality Control System for Lid Assembly
Angara-form
The automated visual inspection system is designed to identify and reject covers that have defects that have arisen during industrial production, as well as visible defects in the form of black dots or dirt on the surface of the cover.
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Software For Visualizing Surface Quality
STATOVISION
Foerster Instruments, Incorporated
In combination with a STATOGRAPH module, the STATOVISION software enables the visualization of eddy current signals in a clearly arranged C-Scan. This results in an image of the surface quality of the components, allowing surface defects to be precisely localized. A major advantage of the STATOVISION software is the pattern recognition, which can be used for surpressing drill holes on brake discs, for example. The documentation of the entire scan is used for continuous quality assurance.
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Electroluminescence Test Systems
The products of the SolarModule EL-inline family are integrated into a module production line, before lamination, after lamination or at the end directly after the performance measurement. High-resolution cameras provide excellent image quality and allow the automatic detection of relevant defects. A manual evaluation of images is no longer necessary, which means that considerable costs can be saved. Communication to upstream and downstream processes is flexible and can be adapted to all common interfaces.
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Vacuum Discharge Test Equipment
DAC-VD-1
DAC-VD-1 can locate defective points such as scars or pinholes on stator coils and wires easily.By applying voltage in a vacuum chamber, the electric arcing from a defective part can be discoveredvisually in a short time. DAC-VD-1 can be used widely in variety of applications from product developments to outgoing inspections.
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Contour Check Round & Edge
Laser measuring systems are of central importance for rolling mills to check the contours of steel profile for defects during the production process. A slight deformation on the surface of the profiles reduces the quality of the product, and in the worst case, a broken roll can even destroy the entire batch. With our systems Contour Check Round & Edge you identify and evaluate deviations at an early stage. Increase the process efficiency of your production - regardless of temperature and profile shape.
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Vision Sensors
Companies in a wide range of industries rely on vision sensors to perform simple pass/fail, go/no go inspections that help ensure products and packaging are error-free and meet strict quality standards. Cognex In-Sight 2000 vision sensors provide easy and reliable inspections thanks to powerful vision tools, modular lighting and optics, and an easy-to-use setup environment. By reducing defects and increasing yield, Cognex vision sensors help manufacturers streamline their operations and increase profitability.
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Software to Order
Our company develops turnkey technical vision systems, including writing software for specific tasks of the Customer, such as:- image capture- algorithms for localization and detection of objects- recognitionalgorithms - inspection algorithms, defect detection- logging and archiving- interface operator- programming FPGAs and controllersand much more
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Receptacle Tester
RT500
Designed to detect the most common wiring problems in standard 120V receptacles.Test for correct wiring, open ground, reverse polarity, open hot, open neutral, hot and ground reversed.Conditions NOT indicated: Quality of ground, multiple hot wires, combinations of defects, reversal of grounded and grounding conductors.Large light indicators for greater visibility.Reinforced prongs for increased durability.Push-pull design with slip-resistance ribbing.Made in USA of U.S. and imported parts.
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Flaw Detectors
Flaw detectors are essential for ensuring the safety and quality of industrial products. They accurately identify defects such as cracks, voids, and inclusions without damaging the materials. Ultrasonic testing is particularly notable for its precision and versatility among the various non-destructive testing methods.
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400x Bench-Top Optical Fiber Microscope - FTM-400X
Shanghai Fibretool Technology Co.,Ltd.
With coaxial illumination optic magnify system, FTM-400X can easily find the slight defects and scratches on fiber endface. High resolution image sensor and 8"pure black and white digital TFT LCD can show the most real details of fiber endface.This is an integrated fiber endface inspector, it combines optical microscope and monitor in a body other than separate designs. It has clear images and long life time. it has series of adaptors for various kinds of connectors such as multi fiber connectors, optical components. It is an essential instrument for optical manufacturing.
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Electrical Testing
Board defects are never an option. Your customer expects perfect boards, each time, every time. Electrical testing is the key in ensuring that the connectivity of a PCB is precisely as specified and that there are no defects or flaws that may cause problems down the line.
