Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Inspection Solutions
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Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
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Product
Deep Inspection Kit
GRL-KIT-DI20
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The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Inspection scope
KI-TK1012
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Inspection scope & cleaning materials. Interchangeable MPO SC LC connectors
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Ultrasound Inspection
ULTRAPROBE 10,000
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The Ultraprobe 10,000 brings Ultrasound Inspection technology to a whole new level. With this one system, inspectors can perform condition analysis, record sounds, store and manage data.
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Product
Wafer Test
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Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Integrated NDT Inspection Device
FlawHunter
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The FlawHunter is an integrated NDT inspection device, equipped with an advanced, high-resolution Laser Shearography sensor with a vacuum (partial) excitation system. It is ergonomic & easy-to-use and is equipped with a workflow-oriented, GUI-display and left/right-hand button control. Regardless of the application, the FlawHunter provides reliable and resolute measurement results for in-field (service) NDT and quality control (post-production) operations.It can be used on any material & surface provided a stable vacuum can be generated within the vacuum seal (viewable inspection area).
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Fixture and Software for Open/Leak Inspection
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In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.
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Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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X5 XL800 X-Ray Inspection
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Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Inspection Microscope
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This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
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DIP Vision Inspection Machine
Optima III
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Landrex Technologies Co., Ltd.
DIP Vision Inspection Machine
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Automatic Flight Inspection System
AT-950
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The AT-950 is the easiest to use and the fastet performing FIS available.
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Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Smart Inspection Station
SiS
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Smart Inspection Systems LLC was born in 2010 in response to orthopedic manufacturers’ demands for faster inspection than their sister industries. Our signature product, the Smart Inspection Station™ (SiS™), is an automated turnkey inspection solution that yields comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. The SiS™ is custom-configured per the client’s needs, yet versatile enough for simultaneous commissioning on multiple product lines. The product of years of refinement, the SiS™ gives comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. Your SiS™ can be custom-configured according to your needs, but is still versatile enough for simultaneous use on multiple product lines. And best of all, every SiS™ purchase comes with ongoing support from L3I’s expert staff.
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End Face Inspection
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Cleave quality inspection. High precision interferometers for checking the end face quality of cleaved optical fibers and for cleave process optimization. Crisp and clear fringe patterns and software with advanced measurement functionality. Ideal for use in production settings and when working with difficult to cleave fibers in laboratory environments. Fiber holder adaptors available for use with cleavers and splicers from the major splicer manufacturers. This facilitates easy transfer of the fiber from cleaver to interferometer and then onto the splicer with no need for reclamping.
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Cleanliness Inspection System / Microscope
CIX90
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The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Product
X-Ray Inspection System
MXI Quadra 5
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Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
