Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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End Face Inspection
Cleave quality inspection. High precision interferometers for checking the end face quality of cleaved optical fibers and for cleave process optimization. Crisp and clear fringe patterns and software with advanced measurement functionality. Ideal for use in production settings and when working with difficult to cleave fibers in laboratory environments. Fiber holder adaptors available for use with cleavers and splicers from the major splicer manufacturers. This facilitates easy transfer of the fiber from cleaver to interferometer and then onto the splicer with no need for reclamping.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Deep Inspection Kit
GRL-KIT-DI20
The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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X5C Compact X-Ray Inspection
Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Lab Inspection & Testing Services
Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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On-site EL/PL Inspection Machine
“EPTiF”
"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Cylinder Inner Wall Inspection
The CylinderInspector is an optical, non-destructive inspection and measurement tool for cylinder surfaces.
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Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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IoT Data Inspection App
Data Explorer
he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application. The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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HD Inspection System
vCam-6
The vCam-6 HD inspection system from Vivax-Metrotech gives you the flexibility to cover a range of inspections including municipal collection systems, residential plumbing, indoor commercial lines, and lateral lines from three inches up to eight inches in diameter. Our camera systems use the latest technology packaged in a rugged, lightweight, compact profile made specifically for the harsh conditions related to sewer lateral inspections. All Vivax-Metrotech camera systems are backed up by a full one-year warranty, on-site training, and local support through our dealer network.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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PosiTector Inspection Kits
PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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Automatic Flight Inspection System
AT-920DG
Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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First Article Inspection Services
API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Inspection Class ROV
Phantom® L Series
THE PHANTOM® L6 IS THE NEWEST IN THE NEXT GENERATION OF PROVEN, RELIABLE UNDERWATER ROBOTICS PIONEERED BY DEEP OCEAN ENGINEERING IN ITS MANUFACTURE OF REMOTELY OPERATED VEHICLES (ROV), BUILT IN THE USA FOR NEARLY FOUR DECADES.
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Full Wafer Contact Test System
Fox 1
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Inspection Tools
Deca XG1040
SATA 3.0 Gbps interface supportedSATA 3.0 Gbps supported. Up to 144PB HDD is supported.Register and edit inspection details (operation modes)Operation modes can be registered and edited using script files in text format.More accurate inspections can be performed using various types of inspections.Provides high speed data transfer at 8GB/minute.(* Varies according to performance of connected HDD.)Deletion and quick diagnostics functionEquipped with overwrite deletion using specified values and DoD (Department of Defense) conforming deletion method.Quick inspections such as SMART status, random seek inspection, entire area read/write inspection can be performed.HDDs connected to each port can be executed, terminated, attached or removed individually.Multiple channels supportedUp to 16 HDDs can be operated by attaching 4 devices.
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Anritsu X-ray Inspection Systems
Choosing the best inspection system is critical to meeting the ever-stricter food quality standards of the world’s leading poultry and meat processors. That’s why Cantrell•Gainco is an authorized distributor for Anritsu X-ray detection equipment, a leading technological powerhouse in the industry.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Magnetic Particle Inspection
Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
