Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
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Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Concrete Inspection
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Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
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Verification And Print Quality Inspection Solutions
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Integrate quality barcode verifiers within your production line using our robust barcode verification technology.
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Product
In-Line X-ray Inspection System
X-eye 6200
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Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Conformal Coating Inspection (CI AOI)
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They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Lab Inspection & Testing Services
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Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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Product
MT Inspection Scope
Um
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● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Product
Industrial CT X-Ray Inspection System
X7000
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The X7000 is North Star Imaging’s largest standard system. The large scanning envelope and generous focal distance allow for unparalleled inspection capabilities of very large objects. The system is great for composites, castings, pipes, tubes, welds and similar parts.
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Product
Inspection System
X-eye 7000B
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Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Incremental Length Gauges For Measuring Stations And Multipoint Inspection Equipment
CERTO series
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*Interferential scanning principle*Very high system accuracy of down to ±0.03 µm*Well-matched ball-bearing guide for very high quality*Defined thermal behavior*Large measuring ranges of up to 60 mm*Interface: 11 µAPP
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Product
3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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Product
3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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Product
Manual Spin Air Bearing Rotary Table for Optimal Circular Geometry Inspection
GeoInspec
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Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
IoT Data Inspection App
Data Explorer
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he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application.The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Product
X5 Pipeline X-Ray Inspection
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Designed to be integrated into the production line and available with product pipes in 2.5 and 3 ", the X5 pipeline is perfect for a wide range of pumped products such as poultry, meat, slurries and sauces. The system is capable of offering good detection levels on a wide range of contaminants including all metal, bone, glass, dense plastics.
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Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Digital Video Inspection Microscope
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Contamination is the first reason for troubleshooting optical networks. Proactive inspection and cleaning of fibre connectors can prevent poor signal performance, damage to equipment, and network downtime. DIAMOND’s Video Microscope Kit contains all necessary tools for proper inspection and cleaning of the connector’s front-faces to help ensure optimal connector performance.
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Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Infrared Camera for CO Detection and Electrical Inspections
FLIR GF346
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The FLIR GF346 optical gas imaging camera detects carbon monoxide (CO) and 17 additional gases without the need to interrupt your plant's production process. CO emissions can be a significant threat to primary steel manufacturing operations; even the slightest leak in a vent stack or pipe can have a devastating effect. With the FLIR GF346, inspectors can scan large areas from a safe distance, pinpointing leaks in real-time, reducing repair down-time, and providing repair verification.
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Printed Circuit Board Inspection System
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NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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Inspection Kits
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Elcometer offers one of the widest ranges of inspection equipment available. Our products are used across numerous industry sectors. In all cases, there is always a need to undertake a number of specific inspections during quality control assessments - as one parameter can affect another.
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Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Hi-Definition Video Inspection Station
VIS800
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Inspection Assist Software
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RVI software is a must for streamlining your inspection processes and improving overall efficiency. Olympus inspection assist software provides support throughout the entire process, whether streamlining on-site inspections or assisting with remote report generation.
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Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
