Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Optical Inspection
Typically, in a standard PCB manufacturing facility, there will be a department where people perform inspection of PCBs through a manual processes, such as visual inspection with magnifiers, microscopes, etc...
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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Inspection Bundle
Cost effective bundle of eVision's inspection librariesIncludes EasyImage, EasyGauge, EasyMatch, EasyObject and EasyColor
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Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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Fiber Optic Inspection Microscope
80761
The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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Optical Inspection Machine
3D AOI
3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Protective Inspection Kit for Hazardous Areas
The kit provides all the tools required for the on-site inspection of a coating, including surface profile, dewpoint, relative humidity, both wet and dry film thickness and also adhesive testing.Measurement parameters include:Surface inspectionSurface profileSurface contaminationClimatic conditionsCoating thicknessAdhesion
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In-Line Inspection
Mapvision | Q
Inspect ALL features for EACH part you manufature within your Takt time – even for the most complex components with hundreds of features.
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Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Substrate Inspection Apparatus
The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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Fiber Optic Inspection & Cleaning
One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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X-ray Inspection System
RTX-113™
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Field Evaluation And Special Inspections
Nemko offers Field Evaluation and Special Inspection Services in the US and Canada as a fast and economical alternative to traditional product safety certification.
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Printed Circuit Board Inspection System
NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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Article Inspection Solution
ExtraEye
First article inspection (FAI) in the PCB assembly process is one of the most important steps - left unchecked every mistake from assembly machine setup multiplies into hundreds of incorrectly assembled PCBs. Maximum accuracy in first article inspection is extremely important.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Tyre Inspection Systems
The VLT tyre inspection system can check several tyre and wheel related items, such as tread depth and sideslip. All measurements are done very fast when the vehicle is on the roller brake tester.
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Automated Inspection Systems
Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Automotive Inspection Kit
Produced specifically for the automotive aftermarket and Insurance Assessors, 3rd party consultants, body shops and used car sales, these kits provide an instant measure of the coating thickness of panels.An illuminated magnifier is supplied to enable close inspection of bodywork.Measurement parameters include:Surface temperatureSurface inspectionCoating thickness
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Thin Film SPY Inspection w/ Built In Jeep Meter
780
For thin film coatings the easy-carry and easy to handle SPY Model 780 speeds inspection time with its built in Jeep meter and various other time saving and comfort features.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Non-Destructive Test Resonant Inspection Station
RAM-TEST-FIXTURE
The NDT Test Station, Model RAM-TEST-FIXTURE Resonant Inspection System is an ideal choice for testing when repeatable manual inspections are required. The innovative Test Station allows precise control of part positioning with an adjustable table ranging up to 6.25 inches (158.75 mm) in height.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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STEEL PLATE INSPECTION MACHINE
Yubain Steel Plate Inspection Machine can effectively detect steel plate problems, including pinholes, hole breaks, hole deviations, leaks, multiple holes or few holes... and other shortcomings, which can help customers efficiently inspect incoming materials and inspections in the manufacturing process. , To avoid product damage due to steel plate problems, reduce financial losses and customer complaints.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
