Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
-
Product
Inspect & Explore Indoor and Confined Spaces
ELIOS
-
Discover the first collision-tolerant drone, designed for the inspection and exploration of the most inaccessible places. Allowing for the first time to fly in complex, cluttered or indoor spaces, Elios unleashes the potential of UAVs in numerous applications where their use was previously too dangerous or simply impossible.
-
-
Product
NI Vision Builder for Automated Inspection (AI)
-
With Vision Builder AI, you can easily configure your vision system. An easy-to-use interactive development environment replaces the complexities of classic programming, making development and maintenance easy without sacrificing performance or functionality.
-
Product
Metrology & Inspection Systems
-
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
-
Product
X-Ray Inspection System
MX1
-
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
-
Product
Inspection Toolkit
OTK-4000
-
The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
-
Product
Inspection & Metrology Platform
Neon
-
Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
-
Product
Baggage and Parcel Inspection
-
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
-
Product
Building Inspection Kit
MR160-KIT2
-
Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
-
Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
-
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
-
Product
Wafer Auto Line Integration
-
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
-
Product
Wafer Cathodoluminescence Microscope
Säntis 300
-
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
-
Product
E-beam Metrology And Inspection
-
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
-
Product
Non-Destructive Test Resonant Inspection System
RAM-AUTO
-
Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
-
Product
Real-time X-ray Inspection Systems
JewelBox Series
-
JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
-
Product
Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
-
The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
-
Product
Value Inspection Cameras
-
General's Value Inspection Cameras offer excellent savings on certain Inspection Cameras such as the DCS280 Rugged Video Inspection System & the KT280 Professional Inspection Kit. Take a look & see if one will meet your needs.
-
Product
DC Safety Inspection Device For Solar Panels
“DC Fault Tester”
-
Identifies defect position instantly- contributes to saving inspection time
-
Product
GENERAL INSPECTION MACHINE AFTER SOLDER MASK
-
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
-
Product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
-
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
-
Product
Entry-level X-ray Inspection System
X-eye 5100 Series
-
100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
-
Product
Measuring And Inspection Systems For Rubber And Tires
-
The rubber processing industry, as well as the tire production process is supported by Micro-Epsilon with a range of systems for inspection, monitoring and control of miscellaneous processes.
-
Product
Industrial CT X-Ray Inspection System
X7000
-
The X7000 is North Star Imaging’s largest standard system. The large scanning envelope and generous focal distance allow for unparalleled inspection capabilities of very large objects. The system is great for composites, castings, pipes, tubes, welds and similar parts.
-
Product
Wireless Fiber Inspection Probe
OCI-20BN-W
-
OCI-20BN-W is a portable optical fiber connector inspector for checking fiber and connector end-face cleanliness, ideal for bench top and fiber optic network installation technicians to eliminate error caused by poor quality or improper cleaning.OCI-20BN-W offers excellent viewing on connector/fiber end-face and is able to feature to record and save image/video of fiber end-face; It can be connected to PC or phone by WIFI.More than 40 assorted high-precision tips designed for inspection solutionsAngled/Lengthened tips for awkward positions.Connect smart phone for testing FiberEye2 is the application on an android or IOS smart phone to capture, display and record the fiber end-face image from the Wi-Fi probe.Connect tablet/laptop for testing EFD is the analysis software on Windows tablet/laptop to have dusts, and scratches on end face inspected, analyzed, compiled and reported
-
Product
Automatic Flight Inspection System
AT-930DG
-
Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
-
Product
Scanning & Inspection
-
API’s offers a range of portable measuring and laser scanning solutions together with robot or tripod mounted 3D structured light scanner.
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
Product
Fiber Optic Inspection Microscope
80761
-
The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
-
Product
High-speed In-Line 3D CT Inspection System
X-eye 6300
-
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
