Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Product
X-Ray and CT Inspection
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Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
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*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Product
Universal Paint Inspection Gauge
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The byko-cut universal is a multi-purpose paint testing instrument that measures paint coating thickness, paint adhesion, and coating hardness.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Deep Inspection Kit
GRL-KIT-DI20
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The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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Product
Testing And Inspection Devices
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HEIDENHAIN offers testing and inspection devices that deliver all setup, monitoring, and diagnostic data needed for the analysis of its encoders. Grid encoders from HEIDENHAIN are ideal for machine tool inspection and acceptance testing, accurately measuring CNC machine tool movements in both static and dynamic inspection.
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Product
3D Automated Optical Inspection
Zenith UHS
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High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
RFID Label Inspection System
Eurotech RFID FS
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The Eurotech RFID FS RFID accurately rewinds rolls of RFID labels and validates their receptivity by running them through the Voyantic Tagsurance RFID inspection system. The unit allows stopping at a predetermined editing spot for the removal and replacement of the defective piece, as well as indicating defective labels by a mark printed by an inkjet system integrated with the machine. Adjustment of the closed loop tension control system can be made through adjusting the parameters on the software that control the servo motor control system. This gives the customer a virtual infinite range with which to wind their labels without cracking the inlay or antenna. As well accurate web adjustment and guidance is provided with a web guide system complete with an ultrasonic sensor. The Eurotech RFID FS RFID label inspection system is equipped with the Voyantic Tagsurance for testing the performance of RFID tags. This is done by verifying that the tag responds to commands on its whole operational frequency range, which means testing the tag on multiple frequencies, also outside the RFID reader frequency. Accurate power output combined with the Voyantic Snoop Pro antenna, optimized for testing tags inline at high speed, allows defining precise acceptance criteria and achieving stable quality.
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Product
In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Product
Article Inspection Solution
ExtraEye
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First article inspection (FAI) in the PCB assembly process is one of the most important steps - left unchecked every mistake from assembly machine setup multiplies into hundreds of incorrectly assembled PCBs. Maximum accuracy in first article inspection is extremely important.
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Connector Inspection
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The USB Connector Inspection System features easy focusing with high resolution imaging. The system includes standard software that provides image display, image capture, digital zoom, auto calibration, and basic analysis tools. Pass/Fail analysis and reporting features are optional software features. The Inspection System scope is fully compatible with the FiberWarrior Pro OTDR as well as other FiberWarrior Pro test sets, providing a full fiber optic testing solution.
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Product
Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Printed Circuit Board Inspection System
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NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Product
Visual Inspection Software
AdVISE
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R&S®AdVISE visual inspection software automates the process of visually monitoring an equipment under test (EUT) during a test sequence. This eliminates human inattention, ensures reproducible results and simplifies the test documentation. A typical application is EMS testing with R&S®EMC32 and R&S®ELEKTRA test software.
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Product
X-Ray Inspection System
MXI Ruby XL
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Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Product
Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Product
Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Product
First Article Inspection Machine
Optima III FAI
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Landrex Technologies Co., Ltd.
First Article Inspection Machine
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Product
2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
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Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Product
Digital Inspection Camera
MaxiVIDEO MV108S
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It turns your Autel tablet into a video inspection scope, allowing you to examine difficult-to-reach areas hidden from sight. It is capable of recording digital still images and videos. Includes mirror, hook and magnet attachments.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
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Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
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Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Protective Coating Inspection Kit 3
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Measurement parameters include:Surface profileSurface temperatureClimatic conditionsCoating thicknessAdhesion
