Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
Edge AI Inference Systems
-
Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
-
Product
Equipment Front End Module Wafer Handler
Sigma EFEM
-
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
Product
Wafer Manufacturing
-
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
-
Product
Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
-
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
-
Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
-
ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
-
Product
MultiSite Test sockets and Wafer Level
-
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
-
Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
-
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
-
Product
Wafer Prober Networking System
PN-300
-
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
-
Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
-
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
-
Product
LED Type Wafer Alignment Sensor Controller
HD-T1
-
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
-
Product
Ambient Temperature Vacuum Wafer Chucks
-
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
-
Product
GC100, Edge AI, NVIDIA® Jetson Xavier™ NX, Wi-Fi & WWAN, PCIe® Optical Cabling
EKF-GC100
-
The GC100 Single-Board-Computer is intended for AI and real-time edge computing. Equipped with the Nvidia® Jetson Xavier™ NX SoM, the board was designed for rugged industrial applications such as IIoT or image processing
-
Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
-
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
Universal Edge Finder
BORDO
-
No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
-
Product
Wafer Sort
-
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
-
Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
-
Product
Solid Edge
-
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
-
Product
TFProbe Wafer Measurement Tools
-
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
-
Product
Laser Type Edge Detection Sensor
LD
-
Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
-
Product
Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
-
The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
-
Product
Edge Gateway
EPC-R3220
-
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
-
Product
Edge AI Acceleration Modules
-
Powered by Intel® Movidius™ Myriad X VPU and Intel® OpenVINO™ toolkit, Advantech VEGA-300 series provides compact, low power plug-in modules to help accelerate deep learning inference on the edge for a wide range of AI-based and computer vision vertical applications.
-
Product
Auto Macro Wafer Defect Inspection
EagleView
-
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
-
Product
Fanless Edge AI System With NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL
-
*NVIDIA® Jetson™ Nano with Maxwell™ architecture with 128 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Optional IP42 cover kit for semi-outdoor applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +60°C*JetPack supported
-
Product
Wafer Chucks
-
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
-
Product
Wafer Inspection Products
-
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
-
Product
NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
-
- Deep learning acceleration with NVIDIA® Jetson™ TX2- Compact fanless system 148(W)x105(D)x50(H)mm- Wide temperature range from -20°C to 70°C
-
Product
High-Performance AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-iX000-P Series
-
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
-
Product
Bare Wafer Inspection System
LS-6700
-
Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
