Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Edge AI Box
EPC-R5710
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Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Nano SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL
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*NVIDIA® Jetson™ Nano with Maxwell™ architecture with 128 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Optional IP42 cover kit for semi-outdoor applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +60°C*JetPack supported
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Product
AIR Edge AI Inference Systems & Servers
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Advantech’s AIR series provide solutions for Edge AI Inference, offering optimal CPU, AI computing, thermal management, and I/O integration
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Product
01 With Soldering Eyelets | 12 Positions | M6 | 2 Wafers
01-2xxx-00/30xx-12-M
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Multi wafer compact selector with 30° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Fanless Scalable Railway Edge AI Platform
AVA-7200
Platform
- EN 50155:2021 certified Edge AI platform.- NVIDIA Ampere GPGPU (A2000/A4500) and Intel® 13th Gen Raptor Lake mobile processor.- Isolated DC 24-110V (200W) or 72-110V (300W) input, configurable by BOM.- Operates at -25°C to 55°C (OT1, ST1) or -25°C to 70°C (OT3, ST1).- 8x 10GbE/2.5GbE M12 X-coded Ethernet, 5x USB, 4x SATA, 4x DI/DO, 2x Serial ports, audio, and DP.- Internal expansion for 1x NVME M.2 slot, 1x 5G M.2 slot with 2x SIM slots, 1x Wifi/BT M.2 slot, 1x mPCIe, accessible by lid opening- QMA antenna on the rear side- Fanless rugged design, conformal-coated for durability, flexibility, and longevity support
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Product
M.2 Edge AI Module With One Intel® Movidius
VEGA-320
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m.2 Edge AI Module with one Intel® Movidius™ Myriad™ X VPU onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks. Scalable for multi video streams edge inference.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
MicroATX Server Board With AMD® EPYC™ 8004, DDR5, PCIe 5.0, And 10GbE For Edge AI, HPC, And Secure Industrial Applications.
ASMB-561
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Powered by SP6 LGA 4844 AMD® EPYC™ 8004 Series processors for high-performance edge computing.Supports up to 576GB of six-channel DDR5 4800 MHz ECC RDIMM memory for massive data processing.Features four PCIe Gen5 x16 slots with CXL support, enabling high-speed GPU and accelerator integration.Equipped with both dual 10GbE (Intel® X710-AT2) and dual GbE (I226) ports for flexible, high-speed networking.Offers four MCIO interfaces for modern storage solutions and five USB 3.2 (Gen1) ports for peripheral devices.Includes two M.2 2280 slots with PCIe Gen4 x4 interface for fast NVMe boot drives and storage.Enhances system security with an onboard TPM 2.0 module integrated via the eSPI interface.Designed for reliability in harsh conditions, supporting a 0 ~ 60°C ambient operating temperature range.
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Product
01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
Controller
Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
IoT Edge Computer With Intel® Celeron® J3455
UNO-247
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Intel® Celeron® J3455 processorRobust design with high stability2 x GbE, 2 x USB3.0, 2 x USB2.0, 4 x RS232, 2 x RS485, 1 x HDMI, 1 x VGACompact size with fanless designRubber stopper design for stand mount and optional kit for DIN-rail mountThreaded DC Jack design for more steady power supplyOptimized mechanical design for easier RAM swapping
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
NVIDIA® Jetson Orin™ NX Edge AI Computer
TREK-50N
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NVIDIA® Jetson Orin™ NX Edge AI Computer for In-Vehicle & Harsh Environments. 12V/24V certified car power (E-Mark, ISO-7637-2), 4ch PoE port or 4ch GMSL2 port input. Rugged platform with IP67, 5M3 (100g/6ms shock, 3 Grms vibration), and -20 to 70°C fanless operation w/o airflow.
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Product
1U OTII-Compliant Edge Server
SKY-7120S
Server Board
1U OTII-compliant edge server with Intel® Xeon® D-2100 CPU. Short-depth, front I/O, and wide temp design for 5G vRAN and mission-critical telecom.
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Product
4U AI GPU Edge Server
AXE-7400SR
MEC Server
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Product
4U 18" Short-Depth Edge Server
HPC-7420+ASMB-977
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4U 18" short-depth edge server with dual 4th Gen Intel® Xeon® CPUs, 4TB DDR5, and 10 PCIe Gen5 slots. Built for massive AI acceleration and HPC.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
4U Edge AI HPC
AIR-510
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4U Edge AI HPC powered by Intel® Raptor Lake S CPU and NVIDIA Certified with RTX™ 6000 Ada Generation. Intel® Raptor Lake S Platform to support Intel® Core™ 14th Gen processors. NVIDIA Certified with RTX™ 6000 Ada Generation graphic card
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Product
Rugged In-Vehicle Edge AI Platform
TREK-60
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Rugged In-Vehicle Edge AI Platform with 8 Channel PoE for In-Vehicle & Harsh Environments. 8ch PoE support for commercial vehicles and heavy duty machinery, In-vehicle specialized design: 12V/24V certified car power (E-Mark, ISO-7637-2), dual CANbus.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
LTE Advanced Edge Computing Gateways - ICR-4400
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The LTE advanced (Cat.12) high-speed 4G routers & powerful edge computing gateways with a variety of interfaces focused on complex router and IoT task.
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Product
Wafer Test
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Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
