Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
-
Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
-
Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
-
Product
Inline Wafer Electrical quality Inspection
ILS-W2
-
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
-
Product
AIR Edge AI HPC
AIR-520 (Generative AI Ready)
-
AIR-520 Edge AI HPC integrates the SQ ai100 AI SSDs, NVIDIA RTX GPU cards, Edge AI SDK, and NVAIE to realize a off-the-shelf Gen AI solution. Affordable Budget - 1/10 traditional GenAI training server cost but same effectiveness.
-
Product
Edge AI Inference Systems
Edge AI Inference System
Powered by NVIDIA Jetson family and RTX, AIR series provides scalable AI inference performance or efficient retraining on a large scale at the edge.
-
Product
Edge SRP
-
Edge SRP includes different packages of bundled hardware and software which can be used for data collection, edge computing, and data visualization.
-
Product
Edge AI Box
-
Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
-
Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
-
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
-
Product
Operation Support System for Wafer Prober
N-PAF
-
N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
-
Product
Pocket-Size Edge IoT Gateway With Intel® Celeron®N6210/Pentium® N6415
UNO-2271G V2
IoT Gateway Platform
Intel® Celeron® Dual core N6210/ Pentium® Quad core N6415 processor with 4GB/8GB DDR4 onboard memoryPocket-size, robust, fanless and cable-free system with high stabilityOptional second stack for increasing functionality including POE, COM, wireless connectivity or iDoor expansionSupport Windows 11 IoT Enterprise LTSC, Win10, Ubuntu Classic and Ubuntu Core 20Microsoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
-
Product
Wafer Level Multi-Die Test System
ITC55WLMD
-
The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
-
Product
Edge AI HPC
AIR-420
-
Edge AI HPC powered by AMD EPYC & Ryzen processors and NVIDIA Qualified RTX™ PRO 6000 Blackwell Max-Q WS Edition. AMD Ryzen 7000/9000 & EYPC 4005 series processor provides up to 16 cores. NVIDIA Qualified with RTX™ PRO 6000 Blackwell Max-Q WS Edition graphic card.
-
Product
Fanless Network Appliance For Edge Deployment With 5G And Wi-Fi6. Ideal For Edge Computing And 5G Network Infrastructure.
FWA-1212VC
-
Intel Atom® C3336/C3558 network SoC with Intel® QuickAssist Technology1 x DDR4 2133/2400MHz, SODIMM (ECC optional) up to 16GB2 x 1GbE SFP/RJ-45 combo ports (auto-negotiation) + 4 x 1GbE RJ-45 LAN portsReserve 1 x M.2 3052/3042 / 1 x M.2 2230 and 1 x Mini-PCIe for RF module selectionDefault 16GB eMMC onboard
-
Product
Edge AI SDK
-
A ready-to-use toolkit for efficient LLM tuning, smooth deployment, and scalable edge AI management, built for reliability and rapid innovation.
-
Product
Wafer Probers
-
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
Product
Wafer Chucks
-
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
-
Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
-
The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
-
Product
WebAccess Software & Edge SRP
-
Advantech’s WebAccess and other IoT software products provide a complete solution for device and data management to enable edge intelligence.
-
Product
Azure SQL Edge
-
Bring the security and performance of the Microsoft SQL engine to the edge with Azure SQL Edge running on ARM64 and x64 architecture. This productivity tool for edge computing combines new capabilities such as data streaming and time series with in-database machine learning and graph features. Develop your application once and deploy anywhere across the edge, your datacenter, and Azure. Get the Microsoft SQL database engine optimized for the edge for as low as USD60 per device.
-
Product
Wafer Chucks
-
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
-
Product
360° Edge Analytics
-
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
-
Product
Compact AI GigE Vision Systems for the Edge with NVIDIA® Quadro® GPU
EOS-i6000-P Series
-
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform,flexible, scalable solution that delivers business value.
-
Product
iBMC Edge Intelligent Solution
Controller
Intelligent board management controller (iBMC) is embedded hardware-based technology that allows administrators to conduct power management remotely.
-
Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
-
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
-
Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
-
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
-
Product
Edge AI Box
EPC-R7000
-
EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
-
Product
Pocket-Size DIN-Rail Edge IPC With Intel® Atom® X6413E
UNO-127
-
Intel® Quad core x6413E processor with 4GB/8GB DDR4 onboard memoryCompact, robust, fanless and cable-free system with high stabilityOptimized basic unit with 2 x GbE, 2 x USB, 1 x HDMIOn-board full-size mPCIe port for various expansion capabilityBuilt-in TPM2.0 for hardware-based securitySystem ground isolation designCertified with IEC 61010-2-201 for industrial applicationUbuntu Core 20 certified hardwareSupport Windows 11 IoT Enterprise LTSC
-
Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
-
Product
Fanless Network Appliance For SD-WAN& UCPE Edge Deployment With Coming 5G & Wi-Fi 6 Support. Ideal For SD-WAN Deployments.
FWA-1112VCL
-
Intel® Atom® C3000, up to 8 CoresIP40, fanless design, 0 ~ 40°C temperature rangeUp to 4 x 1GbE RJ-45 + 2 x 10GbE SFP slots or 1 x 1GbE SFP and 6 x RJ-45 slots5G LTE and Wi-Fi 6 RF certifiedIntel® QAT integrated2 x PoE+ support (optional)
-
Product
Automated Wafer Prober for Magnetic Devices and Sensors
-
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
-
Product
Compact IoT Edge Computer With Intel® 12th Gen. Core™ I Processor
UNO-238 V2
-
12th Gen Intel® Core™ i Processor up to 10 CoresDual Channel DDR5-4800 up to 64GBM.2 E-Key, B-Key, M-Key (support NVMe) expansion for storage/wirelessEquipped with CANBus for reliable communicationDC-in terminal block for wiring flexibilitySupports multiple displays for ThinManager solutionSupports software APIs, WISE DeviceOn, WISE Edge365
