Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Fanless Edge AI System With NVIDIA® JETSON™ Xavier NX SoM, 1 HDMI, 1 GbE LAN, 1 GbE PoE And 2 USB
AIE100-903-FL-NX
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*NVIDIA® Jetson™ Xavier NX with Volta™ architecture with 384 NVIDIA CUDA® cores*High AI computing performance for GPU-accelerated processing*Ideal for edge AI smart city applications*Supports one 15W GbE PoE for camera*Wide operating temperature from -30°C to +50°C*JetPack supported
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Product
Edge Press Technology Bed of Nails Testers
Protector Edge Press Family
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Designed for testing heavy massive boards. Boards with heavy components like large transformers and inductors can destroy normal test fixtures. This design utilizes a 3 plate system where an internal lever actuated sub plate containing the test pins raises to probe the circuit board when the handle is pulled. Heavy boards can bend and break exposed test pins. Similarly large boards which need to be probed by very small delicate test pins can also benefit from this protected test fixture design. This fixture is recommended in situations where there is a high board mass to pin size ratio and pin protection is required. Front and rear panel modular inserts allow for easy updates and customizations to the user hardware interface.
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Edge AI Box
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Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Product
Edge Gateway
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Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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Product
1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
MEC Server
- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Product
Edge Press Technology Bed of Nails Testers
Rand Edge Press Family
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Designed for Research & Development and Pre-Production environments to support often reoccurring product design changes. The primary design focus for this fixture is ease in applying engineering changes and resilience to the abuse of applying multiple engineering changes without damage. In R&D and Preproduction, design changes and updates can occur every week. This Rand fixture, unlike normal test fixtures was designed to be easily taken apart and updated. Constantly disassembling modifying and reassembling a normal bed of nails test fixture over and over again can be a major disaster with wire breakage and test pin bending issues. The modular design of the Rand fixture allows for easy disassembly without flexing the wires or risk of bending test pins. The Rand fixture provides complete easy access for multiple updates requiring machining, drilling and wiring changes.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
NVIDIA® Jetson™ Xavier NX-based Industrial AI Smart Camera for the Edge
NEON-2000-JNX Series
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ADLINK NEON-2000 series is the NVIDIA® Jetson™ based industrial AI cameras, which integrates the Jetson Xavier NX or Jetson™ TX2, Image Sensor, Optimized OS, Rich I/O for vision applications in a compact chassis and verified thermal performance, that saves not only users' TCO (Total Cost Ownership) on the integration and trouble shooting, but also the dimension and cables on the installation.
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Product
Fanless Edge System With NVIDIA® JETSON™ TX2, 1 HDMI 2.0,2 GbE LANs And 1 USB 2.0
eBOX560-900-FL
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The eBOX560-900-FL employs a NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor; a 256 CUDA cores with NVIDIA® Pascal™ GPU Architecture; 8GB of LPDDR4 memory; and 802.11ac Wi-Fi with Bluetooth. It also supports NVIDIA JetPack 3.2 SDK including TensorRT, cuDNN, CUDA Toolkit, VisionWorks, GStreamer, and OpenCV, all built on top of L4T with LTS Linux kernel. The extremely compact system is your superb choices for AI, deep learning, and edge computing. Its tough construction is IP40-rated, and it has an extended operating temperature range of -30°C to +60°C (-22°F to +140°F) and up to 3G vibration endurance.
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Product
Edge AI Platform Powered by NVIDIA® Jetson AGX Xavier™
DLAP-401-Xavier
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- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Product
Industrial IoT Edge Gateway
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Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Product
PCI Edge Connector Card
PMC239/F
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The PMC239/F also comes with a fan. The fan can be disconnected from its power if not needed.
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Product
NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
System
The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Product
Contactless Wafer Geometry Gauge
MX 20x series
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The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
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- Deep learning acceleration with Jetson Xavier™ NX- Compact fanless system 148(W)x120(D)x49.1(H)mm*- Wide temperature range from -20°C to 70°C
