Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
Edge Analytics Applicance
REA-C1000
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Grab your audience’s attention and increase their engagement with intelligent video analytics technology. No matter where the speaker is standing, the handwriting extraction feature ensures that any words and diagrams written on a board or screen remain in full view to the audience — via AR (augmented reality). The Chromakey-less CG Overlay feature enables the presenter to deliver impactful supporting content, in real-time without a dedicated studio or specialized content creators.
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Wafer Chip Inspection System
7940
System
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Edge AI Inference System
AIR-030
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Edge AI Inference system powered by NVIDIA® Jetson AGX Orin™ and 3 x 2.5GbE Lan. Compact and high performance AI box. NVIDIA® Jetson AGX Orin™ 64GB and 32GB Modules.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Edge Compute Solutions
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Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Product
Wafer and Cells PL System
HS-PL
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Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Product
Signage & Edge Computers
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Compact, powerful computers and servers support diverse smart city applications at edge points.
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Product
Edge AI System
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Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
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Product
Wafer ESD Tester lineup
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Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Product
Fanless Edge AI PC
EPC-R7300
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An industrial Fanless Edge AI PC for the NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano systems-on-modules delivers 20–100 TOPS of AI performance.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Compact 2U Edge Server
SKY-821E3
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Compact 2U edge server with dual AMD® EPYC™ 9005/9004 processors, optimized for virtualization, HCI, and edge analytics.
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
Card Edge Connectors
R600
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VECTOR Electronics and Technology, Inc.
R656-2R600 series card edge female connectors for 0.062"(1.57mm) thick boards. Available in wire-wrap or solder tail type termination.Available in 30, 72, 44, 56, 80 and 100 contacts total with dual row.
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Product
AIR Edge AI HPC
AIR-540
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Edge AI HPC Powered by AMD EPYC 8004 series, support 4pcs 2.5-slot GPUs. Powered by the energy-efficient AMD EPYC™ 8004 Series Processor. 4pcs 2.5-slot GPUs for high-density computing. 6x DDR5 ECC-REG RDIMMs for superior reliability and performance.
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Product
Sharp Edge Tester
SE400
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The Sharp Edge Tester is used for determining the sharpness of edges of electrical equipment and other consumer products. A special tape is mounted on a spring loaded arm and dragged over the sharp edge. The tape is then inspected for damages.
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Product
PCI Edge Connector Card
PMC239/F
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The PMC239/F also comes with a fan. The fan can be disconnected from its power if not needed.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers and IoT gateways to accelerate AIoT development.
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Product
16 Channel Leading Edge Discriminator
V895
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The Mod. V895 is a 1-unit wide VME module housing a 16 channel leading edge discriminator. The module accepts 16 negative (positive on request) inputs and produces 16 differential ECL outputs with a fan-out of two on four front panel flat cable connectors.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Edge AI Inference System
AIR-101
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Edge AI Inference System powered by Intel Atom® E3940 QC SoC and two Intel MA2485 VPUs. Intel Atom E3940 Quad Core SoC turbo burst up to 1.8 GHz. Intel® Movidius™ Myriad™ X VPU MA2485 x 2 Built-in.
