Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
WATOM
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Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Industrial IoT Edge Gateway
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Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
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- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
AI Inference System Based On NVIDIA Nova Orin For AMR Applications
MIC-732-AO
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Fanless and ultra-compact design. Embedded with NVIDIA® Jetson AGX Orin™ up to 275 TOPS. Supports 1 x 10GbE, 1 x 2.5GbE, 3 x USB 3.2 Gen 2 (10 Gbit/s). Supports 2 x CANbus, 1 x mPCIe, 2 x Nano SIM slots. Support Total 8-ch GMSL3.0/2.0 with FAKRA connectors.
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Product
Edge Gateway
EPC-R3710
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EPC-R3710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI/LVDS/eDP and rich IO as dual GbE/2serials/3USB/12GPIO. EPC-R4710 also features Mini-PCIe slot for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for HMI, IoT gateway, healthcare application.
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Edge Gateway
EPC-R4760
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EPC-R4760 is an ARM based Box Computer powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GPS. EPC-R4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Win10 IoT core BSPs, this box computer enables customers to easily develop unique application on specific OS.
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Product
Edge AI HPC System
AIR-500D
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Edge AI HPC system powered by Intel® Xeon® D-1700 Series processors with support for up to 4 PCIe slots. Intel® Xeon® D-1700 series processor 4x DDR4 SO-DIMM sockets support ECC/nonECC memory up to 128GB.
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Product
High-Performance All-In-One Gateway For Battery Energy Storage Systems
ECU-1170
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Quad-core Cortex-A55 processor, 1.8GHzConnectivity: 4 GbE, 8 RS-232/485, 2 CAN, 1 mPCle and 1 M.2I/O: 20 DI, 6 DO, 8 Relay, 2 AIBattery-powered RTC, Watchdog, and optional TPM supportWide operating temperature range: -40~70°COptional 5 sec power backup with SupercapacitorSupports IEC 61850, IEC 104, DNP3, Modbus, MQTT, and OPC UAPreloaded with Yocto Linux and EdgeLink or Ubuntu Linux
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Product
NXP I.MX8MPlus Cortex-A53 Edge AI Box Computer
EPC-R3720
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NXP i.MX8M Plus Cortex-A53 Quad/Dual up to 1.8GHz.On-board LPDDR4 6 GB, 4000MT/s memory.HDMI up to 3840 x 2160 at 30Hz resolution.Dual GbE LAN, 1 USB2.0 and 1 USB 3.2 Gen 1.1 Micro SD Socket & 1 Nano SIM Slot.1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot.Supports Windows 10 IoT Enterprise on Arm, Yocto Linux and Android BSP.4 Kinds of Rear I/O for Each Vertical Focus: IEM, Self Service, Automation and Networking.
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Product
Edge Gateway
EPC-R4680
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EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
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Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
Edge Gateway
EPC-R3220
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EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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Product
Edge AI Inference System
AIR-120
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Edge AI inference system powered by Intel® Atom® processor with Hailo-8 AI acceleration module.
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Product
Edge Card Adapter, Universal, for .062 PCB
111107138
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VPC provides two types of Edge Card Adapter Kits for 10, 25 and 50 Module ITA Enclosures. Both kits are designed for various sized cards.The Universal Edge Card Adapter Kit’s card guides are hinged and can be folded for storage by releasing the holding latches on either side of the card.
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Product
Ultra Slim Digital Signage
DS-015
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Power by Nvidia 6-core & 8-core Arm® Cortex-A78AE v8.2 64-bit. Multiple AI workloads up to 157 TOPS (INT8) Ultra-slim design with intelligent fan cooling. Connectivity: 3 × USB 3.2 Gen 1 ports, 1 × USB Type-C (for download mode only) Display & Camera Support: HDMI 4K@60 output and GMSL camera interfaces.
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Edge AI Inference System
AIR-075
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Edge AI Inference system powered by NVIDIA® Jetson Thor™ Powered by NVIDIA Jetson T5000™ and Jetson T4000™, delivering up to 2070 TFLOPS FP4 inference performance. 19~36V wide power and -10~40 °C wide temp. supported.
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Edge Gateway
EPC-R4710
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EPC-R4710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI and rich IO as dual GbE/6serials/6USB/5GPIO. EPC-R4710 also features Mini-PCIe, M.2, and SIM card slots for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for Kiosk, POS, and Vending machine application.
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Product
AI Inference System
MIC-741-AT
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AI Inference System Powered by NVIDIA® Jetson Thor™. Embedded with NVIDIA® Jetson T4000™ up to 1200 TFLOPS (FP4). Supports 1 x SFP28 (1 x 25GbE). Supports 2 x 1GbE, 2 x 10GbE4, 6 x USB 3.2 Gen 2, 2 x M.2 2280, 1 x M.2 Ekey (Support both WiFi AEKey), 1 x M.2 Bkey (LTE,5G).
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Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Edge AI Inference System
AIR-021
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Edge AI Inference system powered by NVIDIA® Jetson Orin™ NX/Nano and Super mode. Compact and high performance AI box. NVIDIA® Jetson Orin NX 16GB/8GB and Orin Nano 8GB Modules. 12~24V wide power and -20~50 °C (NX) -10~50°C (NANO) supported.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Edge AI HPC
AIR-420
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Edge AI HPC powered by AMD EPYC & Ryzen processors and NVIDIA Qualified RTX™ PRO 6000 Blackwell Max-Q WS Edition. AMD Ryzen 7000/9000 & EYPC 4005 series processor provides up to 16 cores. NVIDIA Qualified with RTX™ PRO 6000 Blackwell Max-Q WS Edition graphic card.
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Product
Edge AI Software
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Advantech understands the bottlenecks in developing AI applications and offers full software support to accelerate deployment.
