Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
NXP I.MX8MPlus Cortex-A53 Edge AI Box Computer
EPC-R3720
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NXP i.MX8M Plus Cortex-A53 Quad/Dual up to 1.8GHz.On-board LPDDR4 6 GB, 4000MT/s memory.HDMI up to 3840 x 2160 at 30Hz resolution.Dual GbE LAN, 1 USB2.0 and 1 USB 3.2 Gen 1.1 Micro SD Socket & 1 Nano SIM Slot.1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot.Supports Windows 10 IoT Enterprise on Arm, Yocto Linux and Android BSP.4 Kinds of Rear I/O for Each Vertical Focus: IEM, Self Service, Automation and Networking.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Edge Radius Measurement
EDGEINSPECT
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NOVACAMTM EDGEINSPECTTM system is a modular, non-contact 3D metrology system that:Measures, down to the micron, any type of edge: cutting edges, inside or outside edges, edges on round holes, straight edges, etc.
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
NVIDIA® Jetson™ TX2 Edge Inference Platform
DLAP-201-JT2
Platform
- Deep learning acceleration with NVIDIA® Jetson™ TX2- Compact fanless system 148(W)x105(D)x50(H)mm- Wide temperature range from -20°C to 70°C
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Product
Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Product
The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
System
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Product
Edge AI System
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Axiomtek designs, develops and manufactures edge AI (Artificial Intelligence) systems to fulfill AI solution-ready system requirements. The AI embedded systems are ideal for smart manufacturing, machine vision, deep learning, edge computing, and much more.
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Product
Edge AI Box
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Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Product
Edge Gateway
EPC-R6410
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EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
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Product
Contactless Wafer Gauge for Resistivity, Thickness
MX 60x
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The MX60x series measure Resistivity or Sheet Resistance of silicon and other materials.
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Product
Intelligent Edge Orchestration
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Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Compact 1U Edge Server
SKY-8132S
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Compact 1U edge server with a 3rd Gen Intel® Xeon® CPU and 20.4" depth. A versatile platform for 5G Open RAN, MEC, and AI inference at the edge.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Tunable Edge Filters
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Tunable edge filter is a customized product. It usually belongs to 2-port optical tunable filter product platform. Instead of using narrow bandpass filter in the 2-port tunable optical filter, the tunable edge filter utilizes a low-pass or long-pass interference filter. By changing the incident angle of the light beam, the cut-off wavelength will be tuned. Standard Tunable edge filters support C-band or L-band wavelength range.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
4U AI GPU Edge Server
AXE-7400SR
MEC Server
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Edge Compute Solutions
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Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Product
Solid Edge
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Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Edge Gateway
EPC-R4680
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EPC-R4680 is an ARM based Box Computer powered by Rockchip ARM Cortex-A17 RK3288 Quad core high performance processor, which supports 4K display and 4Kx2K multiformat video decoding via HDMI. It also features M.2, Mini-PCIe and SIM card slots for WIFI, BT and 4G connectivity. EPC-R4680 also offers rich interfaces such as 6 USB2.0, 6 UART, 1 GbE and 8 GPIO. It is an ideal solution for Kiosk, Vending machine and Digital signage application.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
