Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
NVIDIA® Jetson™ TX2-based Industrial AI Smart Camera for the Edge with IP67
NEON-2000-JT2-X Series
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ADLINK's NEON-2000 Series of the NVIDIA® Jetson™ based industrial AI cameras, integrate the Jetson™ Xavier NX or Jetson™ TX2, image sensor, optimized OS, and Rich I/O for vision applications in a compact chassis with verified thermal performance, saving users' Total Cost Ownership on integration and trouble shooting, as well as minizing footprint and cableing required for installation.
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Product
Contour Check Round & Edge
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Laser measuring systems are of central importance for rolling mills to check the contours of steel profile for defects during the production process. A slight deformation on the surface of the profiles reduces the quality of the product, and in the worst case, a broken roll can even destroy the entire batch. With our systems Contour Check Round & Edge you identify and evaluate deviations at an early stage. Increase the process efficiency of your production - regardless of temperature and profile shape.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
In-Process Wafer Inspection System
7945
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Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Edge AI Inference System
AIR-030
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Edge AI Inference system powered by NVIDIA® Jetson AGX Orin™ and 3 x 2.5GbE Lan. Compact and high performance AI box. NVIDIA® Jetson AGX Orin™ 64GB and 32GB Modules.
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Product
Ultra Slim Digital Signage
DS-015
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Power by Nvidia 6-core & 8-core Arm® Cortex-A78AE v8.2 64-bit. Multiple AI workloads up to 157 TOPS (INT8) Ultra-slim design with intelligent fan cooling. Connectivity: 3 × USB 3.2 Gen 1 ports, 1 × USB Type-C (for download mode only) Display & Camera Support: HDMI 4K@60 output and GMSL camera interfaces.
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Product
Sapphire/SIC Wafer Flatness and Surface Appearance System
FM200
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Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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Product
1U 19” Edge Server With 4th Gen Intel® Xeon® Processor Scalable Family Processor
MECS-7120
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- 1U 19” Edge Server with 4th Gen Intel® Xeon® Processor Scalable Family Processor- 6x DDR5 DIMMs, 4800MT/s (6 channels, 1DPC)- On-board 2x 25G SFP28 Ethernet ports- 1U 19’’ rackmount form factor for telecom infrastructure deployment- RunBMC with AST2600, IPMI v2.0/Redfish compliant- Optional clock module to provide time sync from GNSS- Designed for 5G: DU, DU+CU, DU+CU+MEC, MEC, uCPE, industrial edge computing
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Product
Compact Size Mid Tower GPU Server AMD® EPYC™ 8004 Series Processor For Edge AI Inference, Industrial Automation, And Compact GPU Workloads.
SKY-602E3
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Processor: Single AMD® EPYC™8004 Series Server ProcessorMemory: 6 x DDR5-4800 MHz ECC RDIMM, up to 576GBRemote Management: IPMI function supportExpansion: Supports 4 x PCIe x16 double-deck FH/10.5" cards or 2 x PCIe x16 double deck FH/10.5" cards + 4 x PCIe x8 single deck FH/10.5" cardsPSU: 800 Watt 1+1 redundant power supply with 80+ platinum level certification
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
