Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Compact 2U Edge Server
SKY-8234D
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Compact 2U Edge Server based on Dual 4th Gen Intel® Xeon® Scalable Processors for enterprise virtualization, software-defined storage.
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Product
Intelligent Edge Orchestration
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Also known as edge orchestration, intelligent edge, or cloud orchestration, the evolving service cluster represents the newest generation of intelligent network-management system (NMS) technologies and capabilities. The edge-orchestration concept, however, runs much broader and deeper than NMS or element management system (EMS), providing far more intelligent, evolved, and numerous capabilities than originally conceived early-on during the technology's development.
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Product
NVIDIA® Jetson Nano™ Edge Inference Platform
DLAP-211-Nano
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- Deep learning acceleration with NVIDIA® Jetson Nano™- Compact fanless system 148(W)x120(D)x49.1(H)mm- Wide temperature range from -20°C to 70°C
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
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- Deep learning acceleration with Jetson Xavier™ NX- Compact fanless system 148(W)x120(D)x49.1(H)mm*- Wide temperature range from -20°C to 70°C
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Product
AIR Edge AI HPC
AIR-520 (Generative AI Ready)
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AIR-520 Edge AI HPC integrates the SQ ai100 AI SSDs, NVIDIA RTX GPU cards, Edge AI SDK, and NVAIE to realize a off-the-shelf Gen AI solution. Affordable Budget - 1/10 traditional GenAI training server cost but same effectiveness.
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Product
Edge Mini Server System
UBX-510SZ
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Edge Mini Server System with Intel® Xeon® W-12xx or 10th Gen. Core™ i7/i5/i3 Series Processor. Built-in an Intel® Xeon® W-12xx or 10th Gen Core™ i3/i5/i7 processor, Supports Windows Server 2019/2022 or Windows 10/11. Plentiful I/O ports for various apploications, Easy-maintenance hard drive cage for large storage (RAID) capability, Flexible PCIe expansion.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Photonics Wafer Probing Test System
58635
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The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
SQFlash ER-1 U.2 2.5" SSD (SFF-8639) PCIe/NVMe Gen.4 X4, Edge Grade
SQF-CU2 ER-1
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U.2 (SFF-8639) PCIe/NVMe 2.5" SSD, Compliant with PCIe Gen. 4 x 4 interface and NVMe 1.4, AES-256 Support & TCG-OPAL Compliant. Support LDPC with RAID ECC, Read-Intensive and Mixed-Use support. Heat-spreading design with thermal solution, SMART and GUI management tool.
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Product
Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
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The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
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*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Product
Wafer Prober Networking System
PN-300
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The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Wafer Inspection System
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Product
Signage & Edge Computers USM-200 Series
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Rich IO edge computer suitable for connecting standard/customized peripherals.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
UHD Edge Video Server
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The VEGA 7000 is a family of highly configurable video processing servers which has been optimized to scale throughput of live video applications.
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Product
1U Short-Depth Optimized Chassis For ASMB-61 Series Edge Accelerator Server Board For Edge Computing Deployments.
HPC-6120
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Supports ASMB-61 edge series proprietary motherboard18" short-depth chassis designFour PCIe expansion slots supportGPU Card support with active FANTwo hot-swappable 2.5" SATA/SAS/SSD drive baysMultiple power supply options1U Front Bezel in option
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Graphics Cards And Edge AI Acceleration Modules
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Advantech offers the first industrial-grade PCIe GPU cards powered by Intel® Arc™ GPUs, as well as Nvidia Quadro and AMD Radeon.
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Product
Edge Press Technology Bed of Nails Testers
Protector Edge Press Family
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Designed for testing heavy massive boards. Boards with heavy components like large transformers and inductors can destroy normal test fixtures. This design utilizes a 3 plate system where an internal lever actuated sub plate containing the test pins raises to probe the circuit board when the handle is pulled. Heavy boards can bend and break exposed test pins. Similarly large boards which need to be probed by very small delicate test pins can also benefit from this protected test fixture design. This fixture is recommended in situations where there is a high board mass to pin size ratio and pin protection is required. Front and rear panel modular inserts allow for easy updates and customizations to the user hardware interface.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Compact IoT Edge Computer With Intel® Core™ I CPU
UNO-238
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8th generation Intel® Core™ i processor2 x GbE, 4 x USB3.2, 2 x RS-232/422/485, 1 x HDMI, 1 x DP, 1 x GPIO (8 bit)Compact, fanless designRubber stopper for stand mount and optional kit for DIN-rail mountingThreaded DC jack for reliable power supplyOptimized mechanical design for easy RAM swapping
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Product
MiniPCIe Edge AI Module
VEGA-330
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miniPCIe Edge AI Module with two Intel® Movidius™ Myriad™ X VPUs onboard. Intel® Movidius™ Myriad™ X VPU onboard. Ultra compact, Low power consumption. Hardware acceleration for common deep neural networks.
